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MC56F8365VFGE

NXP Semiconductors

MC56F8365VFGE by NXP Semiconductors

MC56F8365VFGE by NXP Semiconductors is a 16-bit DSP with 120 MHz clock frequency, 524288 ROM words, and 36864 RAM bytes. Ideal for industrial applications requiring low power mode, it features a 11-bit address bus width and operates b/w -40 to 105 °C temperature range.

Median Price

$54.620

Lifecycle Status

EOL

Suppliers In-Stock

17

In-Stock Inventory

1k+

MC56F8365VFGE by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 180 parts In-Stock

1+ parts

$54.620

100+ parts

$35.770

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180

$54.620

$35.770

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Chip1Stop

Japan . 180 parts In-Stock

1+ parts

$54.620

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$35.770

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180

$54.620

$35.770

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DigiKey

USA . 852 parts In-Stock

1+ parts

$60.680

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$44.444

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$60.680

$44.444

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Flip Electronics (Authorized)

USA . 300 parts In-Stock

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Verical

USA . 282 parts In-Stock

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$46.725

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$41.813

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$39.350

282

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$46.725

$41.813

$39.350

Rochester

USA . 282 parts In-Stock

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-

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$37.380

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$33.450

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$31.480

282

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$37.380

$33.450

$31.480

Distributors (In-Stock)

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Digiode

USA . 4,097 parts In-Stock

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$39.463

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4,097

$39.463

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Nova Conductors

Japan . 64 parts In-Stock

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$49.870

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Sensible Micro Corp

USA . 15,000 parts In-Stock

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Bristol Electronics

USA . 12,956 parts In-Stock

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Chip Stock

USA . 4,740 parts In-Stock

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Anansix

USA . 1,748 parts In-Stock

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Flip Electronics

USA . 1,020 parts In-Stock

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Cyclops Electronics Ltd

UK . 960 parts In-Stock

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960

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Vyrian

USA . 293 parts In-Stock

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Martec Srl

Italy . 6 parts In-Stock

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J2 Sourcing AB

Sweden . 2 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 943 parts In-Stock

1+ parts

$27.840

100+ parts

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943

$27.840

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Semicontronic

India . 159 parts In-Stock

1+ parts

$35.310

100+ parts

$34.427

1k+ parts

$34.251

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159

$35.310

$34.427

$34.251

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Ampacity Inc.

Singapore . 155 parts In-Stock

1+ parts

$35.310

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155

$35.310

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One Stop Electronics

USA . 129 parts In-Stock

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$35.310

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$35.310

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Corphita

USA . 152 parts In-Stock

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$37.386

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$37.386

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Aranea Global

USA . 100 parts In-Stock

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$48.873

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$46.918

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100

$48.873

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$46.918

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Continental Prestige Electronics

USA . 1,492 parts In-Stock

1+ parts

$49.870

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$48.873

1,492

$49.870

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$48.873

Corohmni

South Africa . 823 parts In-Stock

1+ parts

$49.870

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823

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Vigor

Singapore . 360 parts In-Stock

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$59.110

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$59.110

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Microchip USA

USA . 427 parts In-Stock

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$89.696

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427

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Lixinc

USA . 19,665 parts In-Stock

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ChipTracer

USA . 12,956 parts In-Stock

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UNI Independent Distributors

Spain . 7,172 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 3,144 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,756 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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GreenTree Electronics

Israel . 960 parts In-Stock

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960

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Perfect Parts

USA . 623 parts In-Stock

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623

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MC56F8365VFGE by NXP Semiconductors. This high-quality Digital Signal Processor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With its advanced features and innovative design, this product provides exceptional value and benefits to customers looking for top-notch processing power. Upgrade your projects with the MC56F8365VFGE and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, suitable for portable and long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost in production.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, ensuring the longevity and reliability of the product.

Address Bus Width: 11

Wide address bus width enables efficient data transfer and processing capabilities.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization and allows for easy integration into various system designs.

Bit Size: 16

16-bit architecture provides high processing power and performance for demanding signal processing tasks.

Power Supplies (V): 2.5,3.3

Dual power supply options offer flexibility and compatibility with different voltage requirements in various applications.

No. of Terminals: 128

Ample terminals provide connectivity options and support for multiple input/output interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles offer customization and compatibility with different circuit board layouts and design requirements.

Minimum Supply Voltage: 2.25 V

Offers a low minimum supply voltage for energy efficiency and power savings in operation.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures, suitable for industrial and demanding environments.

CPU Family: 56800E

Part of a specialized CPU family designed for digital signal processing tasks, ensuring optimized performance.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures, suitable for applications in extreme cold environments.

Terminal Finish: TIN

Tin terminal finish provides robust connectivity and resistance to corrosion, ensuring long-term durability.

Terminal Position: QUAD

Quad terminal arrangement offers increased connectivity options and ease of connection in circuit board layouts.

ROM Words: 524288

Large ROM capacity allows storage of extensive program code and data for advanced signal processing applications.

Maximum Seated Height: 1.6 mm

Low profile design with maximum seated height enables space-saving and compact system integration.

Width: 14 mm

Narrow width facilitates installation in tight spaces and compact electronic devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging during manufacturing and maintenance processes.

External Data Bus Width: 4

External data bus width of 4 enhances data transfer speed and efficiency, improving overall system performance.

Maximum Clock Frequency: 120 MHz

High maximum clock frequency enables fast signal processing operations and real-time data processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 40

Capable of withstanding peak reflow temperatures for extended periods without compromising performance or reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robustness and durability during the manufacturing process.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency, suitable for complex signal processing algorithms.

Length: 20 mm

Compact length size allows for flexibility in system design and integration, especially in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC type for digital signal processing ensures optimized performance and compatibility with signal processing tasks.

RAM Bytes: 36864

Large RAM capacity provides sufficient storage for temporary data and enhances processing speed and efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and compatibility with various digital systems.

Terminal Form: GULL WING

Gull wing terminal form ensures secure mechanical connection and facilitates automated assembly processes.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation in various voltage conditions.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast reprogramming of memory contents for flexibility and scalability.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for high-density packaging and integration in space-constrained electronic devices.

Format: FIXED POINT

Fixed-point format ensures accuracy and stability in numerical calculations for precise signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 offers moderate resistance to moisture and humidity, suitable for various environmental conditions.

Speed: 60 rpm

High-speed operation at 60 rpm enables rapid signal processing and efficient data handling in real-time applications.

Low Power Mode: YES

Low power mode functionality helps reduce energy consumption and heat generation, suitable for power-sensitive applications.

Barrel Shifter: YES

Barrel shifter feature enhances computational efficiency and enables faster data manipulation in signal processing operations.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8365VFGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

11

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

4

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC56F8365VFGE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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