Loading...

DSPIC33EP32MC502-E/MM

Microchip Technology

DSPIC33EP32MC502-E/MM by Microchip Technology

DSPIC33EP32MC502-E/MM by Microchip Technology is a 16-bit DSP with 4096 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 3.3V supply, -40 to 125°C temp range, and boundary scan support for robust performance in digital signal processing tasks.

Median Price

$2.574

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.574

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.574

-

-

-

Vyrian

USA . 8,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,024

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,594 parts In-Stock

1+ parts

$2.574

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

$2.574

-

-

-

Continental Prestige Electronics

USA . 752 parts In-Stock

1+ parts

$2.574

100+ parts

-

1k+ parts

-

10k+ parts

$2.523

752

$2.574

-

-

$2.523

Netroflash

USA . 500 parts In-Stock

1+ parts

$2.574

100+ parts

-

1k+ parts

$2.446

10k+ parts

$2.394

500

$2.574

-

$2.446

$2.394

Microchip USA

USA . 2,412 parts In-Stock

1+ parts

$16.107

100+ parts

-

1k+ parts

-

10k+ parts

-

2,412

$16.107

-

-

-

AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$16.291

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$16.291

-

-

-

RGB Technical Solutions

Ukraine . 7,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,642

-

-

-

-

S.R.D Solutions

India . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Overview

Discover the power of cutting-edge technology with the DSPIC33EP32MC502-E/MM by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality Digital Signal Processors that are ideal for a wide range of applications. With advanced features and reliable performance, this product offers customers unparalleled value and benefits. Experience seamless integration, high efficiency, and superior functionality with the DSPIC33EP32MC502-E/MM. Elevate your projects to new heights with Microchip Technology's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power requirements.

Bit Size: 16

16-bit processing capability enables high-performance signal processing tasks.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high-temperature environments, suitable for industrial and automotive applications.

RAM Words: 4096

Ample on-chip data RAM for storing and processing large amounts of data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, extending battery life and improving performance.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the program code, making the DSP versatile for different applications.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption during idle or low activity periods.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32MC502-E/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33EP32MC502-E/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20