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TMS320F2812ZAYS

Texas Instruments

TMS320F2812ZAYS by Texas Instruments

TMS320F2812ZAYS by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data RAM width. Widely used in automotive applications due to its low power mode, FLASH ROM programmability, and multiple internal bus architecture for efficient signal processing.

Median Price

$37.256

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 849 parts In-Stock

1+ parts

$29.933

100+ parts

$26.607

1k+ parts

$19.564

10k+ parts

-

849

$29.933

$26.607

$19.564

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DigiKey

USA . 140 parts In-Stock

1+ parts

$44.580

100+ parts

$34.447

1k+ parts

$30.920

10k+ parts

-

140

$44.580

$34.447

$30.920

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,836 parts In-Stock

1+ parts

$28.436

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-

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3,836

$28.436

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Nova Conductors

Japan . 50 parts In-Stock

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$35.685

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50

$35.685

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Vyrian

USA . 6,271 parts In-Stock

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6,271

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Chip Stock

USA . 2,723 parts In-Stock

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2,723

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Cyclops Electronics Ltd

UK . 1,958 parts In-Stock

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1,958

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 80 parts In-Stock

1+ parts

$25.440

100+ parts

$24.804

1k+ parts

$24.677

10k+ parts

-

80

$25.440

$24.804

$24.677

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Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$25.440

100+ parts

-

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-

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2

$25.440

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Corphita

USA . 1,714 parts In-Stock

1+ parts

$26.940

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-

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1,714

$26.940

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Continental Prestige Electronics

USA . 2,829 parts In-Stock

1+ parts

$32.711

100+ parts

-

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-

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$32.057

2,829

$32.711

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-

$32.057

Aranea Global

USA . 100 parts In-Stock

1+ parts

$34.971

100+ parts

-

1k+ parts

$33.572

10k+ parts

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100

$34.971

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$33.572

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Parana Technologies

USA . 1,117 parts In-Stock

1+ parts

$46.124

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1,117

$46.124

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Advanced Electronics

New Zealand . 28 parts In-Stock

1+ parts

$47.351

100+ parts

$44.984

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$44.984

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28

$47.351

$44.984

$44.984

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$50.788

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1,715

$50.788

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ChromeModa Solutions

Germany . 6,346 parts In-Stock

1+ parts

$51.825

100+ parts

$42.496

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6,346

$51.825

$42.496

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$51.825

100+ parts

$49.234

1k+ parts

$46.642

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1,243

$51.825

$49.234

$46.642

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Corohmni

South Africa . 387 parts In-Stock

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$85.212

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387

$85.212

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Microchip USA

USA . 2,025 parts In-Stock

1+ parts

$87.720

100+ parts

$86.200

1k+ parts

$85.430

10k+ parts

$84.670

2,025

$87.720

$86.200

$85.430

$84.670

Argo Parts USA

USA . 3,964 parts In-Stock

1+ parts

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Lixinc

USA . 3,360 parts In-Stock

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3,360

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TMS320F2812ZAYS Digital Signal Processor. Designed for a wide range of applications, this powerful DSP offers customers exceptional value and performance. With advanced features and a flexible architecture, this product provides numerous benefits for your projects. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Step up your game with the TMS320F2812ZAYS and experience the difference today.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Lightweight and durable material, suitable for portable devices.

Surface Mount

Easy to mount on circuit boards, convenient for manufacturing.

Maximum Supply Voltage 2 V

Operates efficiently with low power consumption.

On Chip Data RAM Width 16

Allows for fast data processing and storage on the chip.

Address Bus Width 19

Enables efficient memory addressing for complex calculations.

Package Shape SQUARE

Space-saving design for compact electronic devices.

Bit Size 32

High processing capability for handling complex algorithms.

No. of Terminals 179

Provides ample connectivity options for peripheral devices.

Package Style (Meter) GRID ARRAY, LOW PROFILE, FINE PITCH

Optimal package design for high-density mounting and thermal performance.

Minimum Supply Voltage 1.81 V

Allows for operation even with slight fluctuations in power supply.

Maximum Operating Temperature 125 °C

Suitable for industrial and automotive applications with high temperature requirements.

CPU Family C28X

Specifically designed for DSP applications, ensuring high performance.

No. of External Interrupts 3

Enables real-time response to external events, improving system reliability.

Minimum Operating Temperature -40 °C

Operates in extreme cold conditions, suitable for a wide range of environments.

Terminal Finish TIN SILVER COPPER

Corrosion-resistant finish for long-term reliability.

ADC Channels YES

Allows for analog-to-digital conversion, essential for signal processing.

Terminal Position BOTTOM

Facilitates easy soldering and connection to the circuit board.

Maximum Seated Height 1.4 mm

Low-profile design for compact device integration.

RAM Words 18432

Sufficient memory capacity for storing and processing data efficiently.

Width 12 mm

Compact size for space-constrained applications.

Boundary Scan YES

Simplifies testing and debugging during manufacturing and maintenance.

External Data Bus Width 16

Efficient data transfer between external devices and the processor.

Maximum Clock Frequency 150 MHz

High-speed processing capabilities for real-time applications.

Maximum Time At Peak Reflow Temperature (s) 30

Handles reflow soldering process effectively within specified time limits.

Peak Reflow Temperature °C 260

Withstands high-temperature reflow soldering processes.

Internal Bus Architecture MULTIPLE

Efficient data routing for improved performance.

Length 12 mm

Compact size for space-constrained applications.

Temperature Grade AUTOMOTIVE

Designed to operate in automotive environments with temperature variations.

Peripheral IC Type DIGITAL SIGNAL PROCESSOR, OTHER

Tailored for digital signal processing applications with versatile peripherals.

No. of Timers 7

Supports multiple timing functions for precise control in applications.

RAM Bytes 36864

Large memory capacity for storing and manipulating data efficiently.

Technology CMOS

Modern technology offering low power consumption and high-speed processing.

Terminal Form BALL

Facilitates soldering and connection to the circuit board.

Maximum Supply Current 230 mA

Efficient power usage without drawing excessive current.

Nominal Supply Voltage 1.9 V

Stable voltage supply for consistent performance.

PWM Channels YES

Supports Pulse Width Modulation for precise control of outputs.

ROM Programmability FLASH

Allows for easy reprogramming of software for flexibility in applications.

Terminal Pitch 0.8 mm

Optimal spacing for connectivity and soldering on the circuit board.

Format FIXED POINT

Suitable for applications requiring fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL) 3

Durable and resistant to moisture, ensuring reliability in various environments.

Low Power Mode YES

Enables energy-efficient operation for extended battery life.

On Chip Program ROM Width 16

Efficient storage of program instructions on the chip.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812ZAYS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

7

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812ZAYS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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