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DSPIC30F2023-20E/PT

Microchip Technology

DSPIC30F2023-20E/PT by Microchip Technology

DSPIC30F2023-20E/PT by Microchip Technology is a 16-bit DSP with 512 RAM words, 24-bit program ROM width, and 8-bit data RAM width. Ideal for automotive applications due to its CMOS technology, low power mode, and flash ROM programmability. Operating temperature ranges from -40 to 125°C.

Median Price

$7.002

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 290 parts In-Stock

1+ parts

$7.002

100+ parts

-

1k+ parts

$6.857

10k+ parts

-

290

$7.002

-

$6.857

-

Verical

USA . 290 parts In-Stock

1+ parts

$7.002

100+ parts

-

1k+ parts

$6.857

10k+ parts

-

290

$7.002

-

$6.857

-

Microchip Technology

USA . 755 parts In-Stock

1+ parts

$8.810

100+ parts

$7.280

1k+ parts

$6.680

10k+ parts

$6.390

755

$8.810

$7.280

$6.680

$6.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$7.844

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$7.844

-

-

-

NAC Semi

USA . 640 parts In-Stock

1+ parts

$9.100

100+ parts

$8.250

1k+ parts

$7.550

10k+ parts

-

640

$9.100

$8.250

$7.550

-

Vyrian

USA . 7,181 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,181

-

-

-

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Flip Electronics

USA . 200 parts In-Stock

1+ parts

-

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1k+ parts

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200

-

-

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ComSIT Distribution GmbH

Germany . 52 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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52

-

-

-

-

Inventory MP

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8

-

-

-

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Bristol Electronics

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 300 parts In-Stock

1+ parts

$6.750

100+ parts

$6.581

1k+ parts

$6.548

10k+ parts

-

300

$6.750

$6.581

$6.548

-

Ampacity Inc.

Singapore . 290 parts In-Stock

1+ parts

$6.750

100+ parts

-

1k+ parts

-

10k+ parts

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290

$6.750

-

-

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AZTECH Wire

Italy . 761 parts In-Stock

1+ parts

$7.562

100+ parts

-

1k+ parts

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10k+ parts

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761

$7.562

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-

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Continental Prestige Electronics

USA . 5,772 parts In-Stock

1+ parts

$7.844

100+ parts

-

1k+ parts

-

10k+ parts

$7.687

5,772

$7.844

-

-

$7.687

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$7.844

100+ parts

$7.452

1k+ parts

-

10k+ parts

$6.981

10

$7.844

$7.452

-

$6.981

Component Stockers USA

USA . 3,027 parts In-Stock

1+ parts

$8.460

100+ parts

$6.990

1k+ parts

$6.420

10k+ parts

-

3,027

$8.460

$6.990

$6.420

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$9.098

100+ parts

$8.371

1k+ parts

$7.844

10k+ parts

-

100

$9.098

$8.371

$7.844

-

Corohmni

South Africa . 19 parts In-Stock

1+ parts

$49.986

100+ parts

-

1k+ parts

-

10k+ parts

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19

$49.986

-

-

-

Aztec Data Supply Inc.

USA . 244 parts In-Stock

1+ parts

$60.057

100+ parts

-

1k+ parts

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244

$60.057

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-

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Lixinc

USA . 5,480 parts In-Stock

1+ parts

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5,480

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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West Coast Incorporated

USA . 2,737 parts In-Stock

1+ parts

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2,737

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Argo Parts USA

USA . 1,648 parts In-Stock

1+ parts

-

100+ parts

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1,648

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Overview

Unlock the power of next-generation digital signal processing with the Microchip Technology DSPIC30F2023-20E/PT. Designed for high performance and reliability, this innovative product is perfect for a wide range of applications in industries such as automotive, telecommunications, and industrial automation. With its advanced features and cutting-edge technology, this DSP offers unmatched value, superior benefits, and a competitive edge to customers looking to revolutionize their products. Trust Microchip Technology to deliver top-quality solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards, making assembly more efficient.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Wide data RAM width allows for faster data processing and storage.

Address Bus Width: 24

Wide address bus allows for accessing a larger memory space, making the DSP suitable for complex applications.

Screening Level: TS 16949

Adheres to high quality standards, ensuring reliability and performance in automotive applications.

Bit Size: 16

Provides a balance between computational power and efficiency, suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Supports multiple power supply options, providing flexibility in design and application requirements.

No. of Terminals: 44

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

Compact package style saves space on the PCB, ideal for applications with size constraints.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages, enabling energy-efficient designs.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for automotive and industrial environments.

No. of External Interrupts: 3

Supports multiple interrupt sources, allowing for efficient handling of external events.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant terminal finish for long-term performance.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and reliable connections.

Maximum Seated Height: 1.2 mm

Low seated height saves space on the PCB and allows for compact designs.

RAM Words: 512

Ample RAM capacity for storing and processing data efficiently.

Width: 10 mm

Compact width allows for flexibility in board layout and space-constrained applications.

External Data Bus Width: 16

Wide external data bus allows for high-speed data transfers and processing.

Internal Bus Architecture: MULTIPLE

Supports multiple internal bus architectures for efficient data flow and processing.

Length: 10 mm

Compact length saves space on the PCB and allows for compact designs.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive environments, meeting high reliability and performance standards.

No. of Timers: 5

Multiple timers provide accurate timing and event scheduling capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and reliable connections.

Maximum Supply Current: 273 mA

Supports high supply currents for powering external components and peripherals.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with a wide range of power sources.

No. of Serial I/Os: 2

Multiple serial I/O ports for interfacing with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updates of software.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for high-density mounting and space-efficient designs.

Format: FIXED POINT

Fixed-point format for efficient integer arithmetic operations and reduced computational complexity.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter for efficient shift operations and data manipulation.

On Chip Program ROM Width: 24

Wide program ROM width for storing and executing program instructions efficiently.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2023-20E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Words:

512

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

273 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC30F2023-20E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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