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PIC24EP512GP806T-I/PT

Microchip Technology

PIC24EP512GP806T-I/PT by Microchip Technology

PIC24EP512GP806T-I/PT by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 53248 RAM words, and 320 mA max supply current. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 9 timers, 15 DMA channels, and FLASH ROM programmability.

Median Price

$10.861

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$10.861

100+ parts

-

1k+ parts

-

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200

$10.861

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Vyrian

USA . 3,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,543

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,215 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,215

$7.000

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Continental Prestige Electronics

USA . 6,041 parts In-Stock

1+ parts

$10.861

100+ parts

-

1k+ parts

-

10k+ parts

$10.643

6,041

$10.861

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-

$10.643

Netroflash

USA . 50 parts In-Stock

1+ parts

$10.861

100+ parts

$10.643

1k+ parts

-

10k+ parts

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50

$10.861

$10.643

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-

AZTECH Wire

Italy . 311 parts In-Stock

1+ parts

$12.397

100+ parts

-

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311

$12.397

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Lixinc

USA . 9,234 parts In-Stock

1+ parts

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9,234

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West Coast Incorporated

USA . 7,236 parts In-Stock

1+ parts

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7,236

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Argo Parts USA

USA . 3,067 parts In-Stock

1+ parts

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3,067

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Futuretech Components

Singapore . 2,796 parts In-Stock

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2,796

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Overview

Discover the power and versatility of the Microchip Technology PIC24EP512GP806T-I/PT, a top-tier digital signal processor that delivers unmatched performance and reliability. With its cutting-edge technology and innovative design, this product is ideal for a wide range of applications in various industries. From advanced control systems to signal processing tasks, this DSP offers exceptional value and benefits to customers looking for high-quality solutions. Trust in Microchip Technology's expertise and experience to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, suitable for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and cost.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power source selection.

RAM Words: 53248

Large RAM capacity enables efficient data processing and storage for complex applications.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast signal processing and execution of tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities makes this product versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization.

Low Power Mode: YES

Low power mode feature helps in conserving energy and prolonging battery life.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP512GP806T-I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

PIC24EP512GP806T-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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