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MC56F8355VFGE

NXP Semiconductors

MC56F8355VFGE by NXP Semiconductors

MC56F8355VFGE by NXP Semiconductors is a 16-bit DSP with 262144 ROM words, operating at up to 120 MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and boundary scan support. With a wide temperature range of -40 to 105°C, this DSP offers high performance in compact FLATPACK package.

Median Price

$36.155

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 252 parts In-Stock

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$35.550

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$35.550

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Verical

USA . 252 parts In-Stock

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$35.550

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252

$35.550

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Chip1Stop

Japan . 537 parts In-Stock

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$36.760

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$25.590

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$25.500

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537

$36.760

$25.590

$25.500

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Mouser Electronics

USA . 547 parts In-Stock

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$57.070

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$41.670

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547

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$41.670

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DigiKey

USA . 250 parts In-Stock

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$57.070

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$41.669

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$57.070

$41.669

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EBV Elektronik

Germany . 1,296 parts In-Stock

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Future Electronics

Canada . 360 parts In-Stock

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$31.810

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Distributors (In-Stock)

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Digiode

USA . 4,262 parts In-Stock

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$30.191

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Nova Conductors

Japan . 500 parts In-Stock

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$35.340

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Sensible Micro Corp

USA . 9,795 parts In-Stock

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Bristol Electronics

USA . 6,730 parts In-Stock

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Vyrian

USA . 573 parts In-Stock

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Chip Stock

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IBS Electronics

USA . 360 parts In-Stock

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$44.614

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Flip Electronics

USA . 216 parts In-Stock

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Anansix

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Distributors (Availability)

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$18.603

100+ parts

$16.929

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$15.254

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$18.603

$16.929

$15.254

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Ampacity Inc.

Singapore . 655 parts In-Stock

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$27.010

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$27.010

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Semicontronic

India . 306 parts In-Stock

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$27.010

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$26.335

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$26.200

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Corphita

USA . 2,307 parts In-Stock

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$28.602

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Continental Prestige Electronics

USA . 4,282 parts In-Stock

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$33.818

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$33.142

4,282

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Netroflash

USA . 2,000 parts In-Stock

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$35.340

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$34.633

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$35.340

$34.633

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Corohmni

South Africa . 5,000 parts In-Stock

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$35.356

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Modulus Dynamics

Lithuania . 385 parts In-Stock

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Vigor

Singapore . 329 parts In-Stock

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$41.900

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Aztec Data Supply Inc.

USA . 3,292 parts In-Stock

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Microchip USA

USA . 2,793 parts In-Stock

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S.R.D Solutions

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Lixinc

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A-Z Elektronik GmbH

Germany . 17,517 parts In-Stock

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ChipTracer

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UNI Independent Distributors

Spain . 4,846 parts In-Stock

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Robosynatics

Brazil . 4,728 parts In-Stock

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Lucentia Tech

USA . 4,728 parts In-Stock

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$34.649

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$33.942

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$33.942

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$33.942

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,293 parts In-Stock

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Perfect Parts

USA . 904 parts In-Stock

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GreenTree Electronics

Israel . 635 parts In-Stock

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Overview

Unleash the power of digital signal processing with the MC56F8355VFGE by NXP Semiconductors. Setting new standards in performance and efficiency, this DSP is a game-changer for applications ranging from audio processing to motor control. With cutting-edge technology and superior quality, NXP Semiconductors ensures that customers experience unmatched value and benefits. Elevate your projects with the MC56F8355VFGE and discover the difference that NXP Semiconductors can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and durability for the DSP, making it suitable for various environments.

Maximum Supply Voltage: 2.75 V

Allows for efficient power usage while still providing enough voltage for operations.

Bit Size: 16

Offers a high processing capability for complex signal processing tasks.

ROM Words: 262144

Large ROM capacity for storing program instructions and data, enabling versatile functionality.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions, enhancing its versatility.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8355VFGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

11

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

4

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC56F8355VFGE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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