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TMS320F2812GHHS

Texas Instruments

TMS320F2812GHHS by Texas Instruments

TMS320F2812GHHS by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data bus width. Ideal for automotive applications due to AEC-Q100 screening level, low power mode, and multiple timers for efficient signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,442 parts In-Stock

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Digiode

USA . 4,051 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Chip Stock

USA . 135 parts In-Stock

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135

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AZTECH Wire

Italy . 409 parts In-Stock

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$13.351

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409

$13.351

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$22.761

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$20.713

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$18.664

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$22.761

$20.713

$18.664

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Ampacity Inc.

Singapore . 1,560 parts In-Stock

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$26.000

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$26.000

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One Stop Electronics

USA . 788 parts In-Stock

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$32.000

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788

$32.000

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Parana Technologies

USA . 2,287 parts In-Stock

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$33.798

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$134.968

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$33.798

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$134.968

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Semicontronic

India . 521 parts In-Stock

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$35.000

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$34.125

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$33.950

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521

$35.000

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$33.950

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DigiPath Technology Company

USA . 1,367 parts In-Stock

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$37.216

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$37.216

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ChromeModa Solutions

Germany . 2,063 parts In-Stock

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$37.975

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$31.140

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2,063

$37.975

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IDEA Electronic Components Group

UK . 1,284 parts In-Stock

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$37.975

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$36.076

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$34.178

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Corohmni

South Africa . 119 parts In-Stock

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$68.800

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Continental Prestige Electronics

USA . 5,759 parts In-Stock

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Corphita

USA . 4,621 parts In-Stock

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Argo Parts USA

USA . 2,859 parts In-Stock

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Assy Fe

Spain . 320 parts In-Stock

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320

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Futuretech Components

Singapore . 219 parts In-Stock

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Lixinc

USA . 214 parts In-Stock

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Microchip USA

USA . 166 parts In-Stock

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Overview

Unlock the power of real-time digital signal processing with the TMS320F2812GHHS by Texas Instruments. This high-quality DSP offers unmatched performance and reliability, making it the perfect choice for a wide range of applications in industries such as automotive, industrial automation, and telecommunications. With advanced features and innovative technology, this product delivers exceptional value, efficiency, and flexibility to meet the unique needs of customers. Experience the advantages of Texas Instruments' expertise and the cutting-edge capabilities of the TMS320F2812GHHS for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this DSP lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration and saves space on the PCB.

Maximum Supply Voltage: 2 V

With a maximum supply voltage of 2V, this DSP is suitable for low-power applications.

On Chip Data RAM Width: 16

A wide 16-bit on-chip data RAM width ensures efficient data processing and storage.

Address Bus Width: 19

The 19-bit address bus width enables access to a larger memory space for complex algorithms.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact form factor ideal for space-constrained designs.

Bit Size: 32

A 32-bit architecture provides high computational power for signal processing tasks.

Power Supplies (V): 1.8,3.3

Supporting multiple power supply voltages allows flexibility in system design and power management.

No. of Terminals: 179

The large number of terminals enables connectivity to various peripherals and external components.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812GHHS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812GHHS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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