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TMS320F2812ZHHAR

Texas Instruments

TMS320F2812ZHHAR by Texas Instruments

TMS320F2812ZHHAR by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 16-bit data RAM, and 19-bit address bus width. Ideal for industrial applications requiring high-speed processing, it features low power mode, boundary scan support, and 8 timers for versatile functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,821 parts In-Stock

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Digiode

USA . 2,044 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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One Stop Electronics

USA . 1,242 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 877 parts In-Stock

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$7.566

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Semicontronic

India . 831 parts In-Stock

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$16.000

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$15.600

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$15.520

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831

$16.000

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Parana Technologies

USA . 1,414 parts In-Stock

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$21.531

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$21.916

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$21.531

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$21.916

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DigiPath Technology Company

USA . 2,253 parts In-Stock

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$23.708

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$21.812

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ChromeModa Solutions

Germany . 6,689 parts In-Stock

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$24.192

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$19.837

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IDEA Electronic Components Group

UK . 398 parts In-Stock

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$24.192

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$22.982

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$21.773

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398

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$21.773

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Ampacity Inc.

Singapore . 1,647 parts In-Stock

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$34.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$41.204

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$39.144

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$39.144

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Corohmni

South Africa . 647 parts In-Stock

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Lixinc

USA . 11,816 parts In-Stock

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Continental Prestige Electronics

USA . 5,810 parts In-Stock

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Argo Parts USA

USA . 4,027 parts In-Stock

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Corphita

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 800 parts In-Stock

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Microchip USA

USA . 224 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320F2812ZHHAR by Texas Instruments, a leading manufacturer in the industry. This cutting-edge digital signal processor is perfect for a wide range of applications, offering customers exceptional value and benefits. From its high-quality materials to its advanced features, this product provides users with a seamless experience and unmatched advantages in their projects. Trust Texas Instruments to deliver top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY: This material provides durability and protection for the DSP, making it suitable for various applications.

Surface Mount

YES: This feature allows for easy and secure mounting on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage

2 V: The high maximum supply voltage ensures stable and reliable operation of the DSP in various operating conditions.

On Chip Data RAM Width

16: The wide data RAM width allows for efficient processing and storage of data, enhancing overall performance.

Address Bus Width

19: The extensive address bus width enables the DSP to access a large memory space, ideal for complex algorithms and calculations.

Screening Level

AEC-Q100: This screening level guarantees high-quality and reliable performance, meeting industry standards for automotive applications.

Package Shape

SQUARE: The square package shape provides a compact form factor, saving space and making it suitable for small designs.

Bit Size

32: The large bit size enhances the processing capability of the DSP, enabling fast and accurate computations.

Power Supplies (V)

1.8,3.3: The multiple power supply options allow flexibility in design and compatibility with different voltage requirements.

No. of Terminals

179: The high number of terminals ensures connectivity with various components, accommodating complex circuitry configurations.

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH: This package style offers enhanced reliability, thermal performance, and ease of integration in designs.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812ZHHAR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

9216

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812ZHHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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