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DSPIC33FJ128GP708AT-E/PT

Microchip Technology

DSPIC33FJ128GP708AT-E/PT by Microchip Technology

DSPIC33FJ128GP708AT-E/PT by Microchip is a 16-bit DSP with 3.3V supply, 40MHz clock frequency, and flash ROM programmability. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and thin profile package style. With 80 terminals in a square shape, it's suitable for digital signal processing tasks requiring high performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 614 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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AZTECH Wire

Italy . 752 parts In-Stock

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$15.130

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Ampacity Inc.

Singapore . 256 parts In-Stock

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$21.000

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Marpe Global Electronics

Taiwan . 8,207 parts In-Stock

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XL Components Corporation

Australia . 6,661 parts In-Stock

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QualityLine Systems

Poland . 3,977 parts In-Stock

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Continental Prestige Electronics

USA . 2,207 parts In-Stock

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Argo Parts USA

USA . 459 parts In-Stock

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Bastille Electronics

Australia . 82 parts In-Stock

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Overview

Experience the power of innovation with the DSPIC33FJ128GP708AT-E/PT by Microchip Technology. As a leader in digital signal processors, Microchip Technology delivers top-quality products that push the boundaries of technology. Designed for a range of applications, this DSP offers unparalleled performance and reliability. With a focus on value and customer satisfaction, this product provides countless benefits to users seeking cutting-edge solutions. Upgrade your projects with the DSPIC33FJ128GP708AT-E/PT and witness the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this DSP can operate reliably even in applications with varying voltage levels.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it easier to integrate into compact designs.

Bit Size: 16

A 16-bit architecture allows for high precision processing of digital signals, suitable for a wide range of applications requiring accurate calculations.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V provides the DSP with a standard voltage level commonly used in electronics, ensuring compatibility with existing systems.

No. of Terminals: 80

Having 80 terminals allows for the DSP to interface with multiple peripherals and components, enabling versatile functionality in complex systems.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers a compact form factor, making it suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures that the DSP can operate reliably even in low power scenarios, conserving energy.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this DSP can withstand high temperature environments, making it suitable for industrial or automotive applications.

Minimum Operating Temperature: -40 °C

The DSP's minimum operating temperature of -40°C allows for reliable performance in cold environments, ensuring functionality in a wide range of conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a reliable electrical connection and corrosion resistance, contributing to the longevity and reliability of the DSP.

Terminal Position: QUAD

The quad terminal position allows for ease of soldering and secure connection to the PCB, facilitating efficient assembly processes.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2mm, this DSP occupies minimal vertical space on the PCB, enabling compact designs without sacrificing functionality.

Width: 12 mm

A width of 12mm provides a compact form factor for the DSP, allowing for integration into small devices and systems.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40MHz enables fast and efficient processing of digital signals, crucial for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures reliable soldering during assembly, contributing to the overall quality and durability of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the DSP can withstand high-temperature soldering processes without compromising performance.

Length: 12 mm

A length of 12mm contributes to the compact form factor of the DSP, enabling space-efficient designs in various applications.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade indicates that the DSP meets the stringent requirements for reliability and performance in automotive applications, ensuring robust operation in challenging environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The DSP with controller peripherals offers versatile functionality, allowing it to perform signal processing tasks as well as control and interface with external components in a single package.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the DSP energy-efficient and suitable for a wide range of power-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connections, enhancing the reliability and longevity of the DSP in various operating conditions.

Maximum Supply Current: 90 mA

With a maximum supply current of 90mA, this DSP consumes low power while delivering high performance, making it an energy-efficient choice for battery-operated devices.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard voltage levels used in electronic systems, simplifying integration and deployment of the DSP.

ROM Programmability: FLASH

ROM programmability via flash memory allows for easy firmware updates and customization, enabling flexibility and adaptability in the DSP's operation.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the DSP provides high-density interconnectivity, enabling compact PCB designs and efficient use of space.

Format: FIXED POINT

Operating in fixed-point format enables efficient processing of numerical data with reduced computational complexity, making the DSP suitable for high-speed signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128GP708AT-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC33FJ128GP708AT-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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