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DSPIC33EP128GM306-I/MR

Microchip Technology

DSPIC33EP128GM306-I/MR by Microchip Technology

DSPIC33EP128GM306-I/MR by Microchip Technology is a 16-bit DSP with 3.3V supplies, 60MHz clock frequency, and 16384 RAM words. Ideal for industrial applications, it features 15 timers, flash ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$6.657

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.657

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50

$6.657

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Vyrian

USA . 8,460 parts In-Stock

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8,460

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 627 parts In-Stock

1+ parts

$6.280

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627

$6.280

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Continental Prestige Electronics

USA . 204 parts In-Stock

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$6.657

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$6.524

204

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$6.524

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$6.657

100+ parts

$6.324

1k+ parts

$6.008

10k+ parts

$5.925

450

$6.657

$6.324

$6.008

$5.925

AZTECH Wire

Italy . 453 parts In-Stock

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$19.270

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453

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Kepictronics

USA . 23,757 parts In-Stock

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LOOK Integrated Logistics

Peru . 8,144 parts In-Stock

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Montano Global Distributors

Canada . 4,552 parts In-Stock

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Argo Parts USA

USA . 2,255 parts In-Stock

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LMD Electronica

Estonia . 368 parts In-Stock

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368

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NIA Electronics

USA . 204 parts In-Stock

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Ledger Components

France . 204 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the cutting-edge DSPIC33EP128GM306-I/MR by Microchip Technology. Crafted with precision and expertise, this innovative digital signal processor offers unparalleled performance and efficiency in a compact package. Perfect for a wide range of applications, from automotive to industrial control systems, this DSP provides exceptional value and benefits to customers seeking top-tier quality and reliability. Stay ahead of the curve with Microchip's industry-leading technology and unlock endless possibilities with the DSPIC33EP128GM306-I/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V provides flexibility in power supply options for the DSP.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Bit Size: 16

16-bit processing capability enables efficient handling of data and complex algorithms.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 85°C ensures reliable performance in various environmental conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and customization of the DSP's firmware.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM306-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP128GM306-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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