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TMS320F28335ZHHA

Texas Instruments

TMS320F28335ZHHA by Texas Instruments

TMS320F28335ZHHA by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 68 RAM words, and 32-bit external data bus width. Ideal for industrial applications requiring high-speed processing, it features low power mode, flash ROM programmability, and AEC-Q100 screening level.

Median Price

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5

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1k+

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Digiode

USA . 3,332 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 550 parts In-Stock

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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ComSIT USA

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Semicontronic

India . 609 parts In-Stock

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$2.000

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$1.950

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$1.940

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609

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AZTECH Wire

Italy . 374 parts In-Stock

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$13.180

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One Stop Electronics

USA . 1,468 parts In-Stock

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Parana Technologies

USA . 1,543 parts In-Stock

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$26.251

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$26.845

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DigiPath Technology Company

USA . 2,234 parts In-Stock

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$28.905

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$26.593

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ChromeModa Solutions

Germany . 2,256 parts In-Stock

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$29.495

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

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Ampacity Inc.

Singapore . 301 parts In-Stock

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Corohmni

South Africa . 3,188 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Perfect Parts

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Futuretech Components

Singapore . 1,280 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Bastille Electronics

Australia . 96 parts In-Stock

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iodParts Technologies Inc.

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Overview

Unlock the potential of your digital signal processing projects with the TMS320F28335ZHHA by Texas Instruments. Designed with precision and quality in mind, this DSP offers unparalleled performance and efficiency for a wide range of applications. Whether you're working on automotive electronics, industrial automation, or power management systems, this processor delivers the speed, reliability, and flexibility you need to bring your ideas to life. Trust in Texas Instruments' legacy of innovation and choose the TMS320F28335ZHHA for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

With surface mount capability, this product offers easy and flexible installation on PCBs, saving time and space.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for efficient performance and reliable operation in various power conditions.

On Chip Data RAM Width: 16

The 16-bit data RAM width enables fast data processing and storage, enhancing the overall speed and performance of the DSP.

Address Bus Width: 20

The 20-bit address bus width provides ample addressing capability, allowing for extensive memory access and efficient data management.

Screening Level: AEC-Q100

With AEC-Q100 screening, this product meets automotive quality standards, ensuring reliability and durability even in harsh environments.

Package Shape: SQUARE

The square package shape offers efficient use of space on PCBs, making it suitable for compact designs and tight layouts.

Bit Size: 32

The 32-bit architecture of this DSP allows for high-speed data processing and complex calculations, making it suitable for demanding applications.

Power Supplies (V): 1.9,3.3

The availability of power supplies at 1.9V and 3.3V offers flexibility in power options, accommodating various voltage requirements.

No. of Terminals: 179

With 179 terminals, this product enables versatile connectivity and interfaces, allowing for seamless integration with other components.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28335ZHHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

179

No. of Timers:

21

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

RAM Words:

68

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28335ZHHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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