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MC56F8335VFGE

NXP Semiconductors

MC56F8335VFGE by NXP Semiconductors

MC56F8335VFGE by NXP Semiconductors is a 16-bit DSP with 11-bit address bus, operating at up to 120 MHz. Ideal for industrial applications, it features low power mode, FLASH ROM programmability, and a max temperature of 105°C.

Median Price

$19.365

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Future Electronics

Canada . 576 parts In-Stock

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$19.040

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EBV Elektronik

Germany . 216 parts In-Stock

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Rochester

USA . 35 parts In-Stock

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$19.690

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$17.620

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$16.580

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Distributors (In-Stock)

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Digiode

USA . 2,016 parts In-Stock

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$18.668

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Nova Conductors

Japan . 100 parts In-Stock

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$25.030

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Vyrian

USA . 5,072 parts In-Stock

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Anansix

USA . 2,193 parts In-Stock

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IBS Electronics

USA . 576 parts In-Stock

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$27.237

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$26.002

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Chip Stock

USA . 483 parts In-Stock

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Flip Electronics

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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Lakeland Logistics Inc

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 702 parts In-Stock

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$11.137

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Vigor

Singapore . 417 parts In-Stock

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$15.250

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Semicontronic

India . 263 parts In-Stock

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$16.700

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$16.282

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$16.199

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Ampacity Inc.

Singapore . 138 parts In-Stock

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$16.700

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Corphita

USA . 200 parts In-Stock

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$17.685

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Continental Prestige Electronics

USA . 3,109 parts In-Stock

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$23.945

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$23.466

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Corohmni

South Africa . 2,534 parts In-Stock

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$25.187

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Microchip USA

USA . 2,013 parts In-Stock

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$52.570

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Aztec Data Supply Inc.

USA . 1,688 parts In-Stock

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$61.665

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UNI Independent Distributors

Spain . 6,722 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 500 parts In-Stock

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$24.529

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$23.779

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$23.278

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Experience the unmatched performance and reliability of the MC56F8335VFGE by NXP Semiconductors, a leading manufacturer in the industry. This digital signal processor (DSP) offers exceptional value with its cutting-edge technology and versatile applications. From industrial automation to consumer electronics, this product delivers superior processing power with low power consumption, making it the ideal choice for your next project. Upgrade your designs with the MC56F8335VFGE and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy efficient.

Address Bus Width: 11

The wide address bus width allows for efficient data processing and memory access, enhancing overall performance.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the DSP into various hardware designs and layouts.

Bit Size: 16

The 16-bit architecture provides high processing power and performance, making the DSP suitable for complex signal processing tasks.

Power Supplies (V): 2.5, 3.3

The availability of multiple power supply options allows for flexible voltage operation and compatibility with different systems.

No. of Terminals: 128

The high number of terminals provides ample connectivity options for external components and peripherals, making the product versatile.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures reliable operation even under low power conditions, improving overall system stability.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the DSP suitable for industrial applications where temperature fluctuations are common.

CPU Family: 56800E

The 56800E CPU family offers advanced features and capabilities, making the DSP a powerful and efficient processing solution.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the DSP to operate in harsh environments or extreme conditions, ensuring reliable performance.

Terminal Finish: TIN

The TIN terminal finish provides good conductivity and solderability, improving overall connectivity and reliability.

ROM Words: 65536

The large ROM capacity allows for storing a vast amount of program data and instructions, making the DSP versatile and adaptable.

Maximum Seated Height: 1.6 mm

The low seated height enables compact and slim designs, making the DSP suitable for space-constrained applications.

Width: 14 mm

The moderate width of the DSP package allows for easy integration into standard PCB layouts and designs.

Boundary Scan: YES

The boundary scan feature facilitates efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 4

The wide external data bus width allows for fast data transfer and communication between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 120 MHz

The high maximum clock frequency enables fast processing and execution of instructions, making the DSP suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time ensures quick and efficient soldering during PCB assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and durable solder joints, ensuring long-term performance and reliability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data processing efficiency and speed, improving overall system performance.

Length: 20 mm

The compact length of the DSP package allows for space-efficient designs, ideal for compact electronic devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the DSP suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP with peripheral IC type offers versatile connectivity options and compatibility with various external devices, enhancing overall system functionality.

RAM Bytes: 12288

The large RAM capacity allows for efficient memory storage and data processing, enhancing overall system performance and responsiveness.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making the DSP energy efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and reliable electrical connections, ensuring long-term performance and durability.

Nominal Supply Voltage: 2.5 V

The stable nominal supply voltage ensures consistent and reliable operation of the DSP, improving overall system stability and performance.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and efficient reprogramming of the DSP, enabling quick updates and modifications as needed.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and compact designs, ideal for space-constrained applications and portable devices.

Format: FIXED POINT

The fixed-point format allows for fast and efficient arithmetic operations, making the DSP suitable for real-time signal processing and calculations.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, ensuring reliable operation in normal environmental conditions.

Speed: 60 rpm

The high speed of 60 rpm allows for fast data processing and calculations, making the DSP suitable for time-critical applications.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low activity periods, improving energy efficiency and battery life.

Barrel Shifter: YES

The barrel shifter feature enables efficient bitwise operations and data manipulation, enhancing overall processing speed and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8335VFGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

11

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

4

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC56F8335VFGE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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