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TMS320C6747DZKB3

Texas Instruments

TMS320C6747DZKB3 by Texas Instruments

TMS320C6747DZKB3 by Texas Instruments is a 32-bit DSP with integrated cache, 16-bit external data bus width, and 30 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode, it features 8192 RAM words and 1.2-3.3 V power supplies.

Median Price

$17.118

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

1+ parts

$5.504

100+ parts

$5.411

1k+ parts

-

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4

$5.504

$5.411

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Verical

USA . 4 parts In-Stock

1+ parts

$12.282

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-

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4

$12.282

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Texas Instruments

USA . 4,320 parts In-Stock

1+ parts

$14.900

100+ parts

$13.015

1k+ parts

$8.976

10k+ parts

-

4,320

$14.900

$13.015

$8.976

-

Chip1Stop

Japan . 4 parts In-Stock

1+ parts

$19.337

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-

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4

$19.337

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-

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DigiKey

USA . 484 parts In-Stock

1+ parts

$21.700

100+ parts

$15.167

1k+ parts

$14.148

10k+ parts

-

484

$21.700

$15.167

$14.148

-

Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$21.700

100+ parts

$14.710

1k+ parts

$14.140

10k+ parts

-

130

$21.700

$14.710

$14.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 40 parts In-Stock

1+ parts

$13.021

100+ parts

$8.138

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-

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40

$13.021

$8.138

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-

Digiode

USA . 2,678 parts In-Stock

1+ parts

$14.155

100+ parts

-

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2,678

$14.155

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$15.610

100+ parts

-

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10

$15.610

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Vyrian

USA . 4,713 parts In-Stock

1+ parts

-

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4,713

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Sensible Micro Corp

USA . 288 parts In-Stock

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288

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

1+ parts

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40

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Dan-Mar Components

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 382 parts In-Stock

1+ parts

$12.660

100+ parts

-

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382

$12.660

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Corphita

USA . 3,428 parts In-Stock

1+ parts

$13.410

100+ parts

-

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3,428

$13.410

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$15.298

100+ parts

-

1k+ parts

$14.686

10k+ parts

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100

$15.298

-

$14.686

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Continental Prestige Electronics

USA . 5,735 parts In-Stock

1+ parts

$15.610

100+ parts

-

1k+ parts

-

10k+ parts

$15.298

5,735

$15.610

-

-

$15.298

Corohmni

South Africa . 398 parts In-Stock

1+ parts

$23.956

100+ parts

-

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398

$23.956

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Parana Technologies

USA . 2,090 parts In-Stock

1+ parts

$33.072

100+ parts

-

1k+ parts

$118.531

10k+ parts

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2,090

$33.072

-

$118.531

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ChromeModa Solutions

Germany . 4,196 parts In-Stock

1+ parts

$37.160

100+ parts

$30.471

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4,196

$37.160

$30.471

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IDEA Electronic Components Group

UK . 329 parts In-Stock

1+ parts

$37.160

100+ parts

$35.302

1k+ parts

$33.444

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329

$37.160

$35.302

$33.444

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Argo Parts USA

USA . 3,704 parts In-Stock

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3,704

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DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

-

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$33.503

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1,059

-

$33.503

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Lixinc

USA . 900 parts In-Stock

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900

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Perfect Parts

USA . 306 parts In-Stock

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306

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Kepictronics

USA . 38 parts In-Stock

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38

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Overview

Unlock the power of cutting-edge technology with the TMS320C6747DZKB3 by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers top-quality products that excel in a variety of applications. Experience seamless performance, enhanced efficiency, and unmatched reliability with the TMS320C6747DZKB3. From advanced audio processing to high-speed data analytics, this DSP is designed to elevate your projects to new heights. Trust in Texas Instruments to provide unparalleled value and innovation, setting you up for success in any endeavor. Elevate your work with the TMS320C6747DZKB3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, enhancing the overall performance of the product.

Bit Size: 32

With a 32-bit architecture, the product can handle complex calculations and data processing tasks effectively.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency allows for fast data processing and real-time signal analysis.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specialized IC type ensures optimal performance for digital signal processing tasks, making it a reliable choice for such applications.

Technology: CMOS

Being based on CMOS technology, the product offers low power consumption and high noise immunity, contributing to its efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747DZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747DZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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