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TMS32C6416EGLZ7E3

Texas Instruments

TMS32C6416EGLZ7E3 by Texas Instruments

TMS32C6416EGLZ7E3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 75.18 MHz clock frequency. Ideal for digital signal processing applications due to its 64-bit external data bus width and low power mode feature. Package style includes grid array and heat sink/slug, making it suitable for various industrial uses.

Median Price

$231.161

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 189 parts In-Stock

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$212.560

100+ parts

$199.810

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$187.050

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$187.050

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DigiKey

USA . 189 parts In-Stock

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Verical

USA . 107 parts In-Stock

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$249.762

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$233.813

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107

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$233.813

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Distributors (In-Stock)

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Nova Conductors

Japan . 34 parts In-Stock

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$193.020

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Digiode

USA . 4,118 parts In-Stock

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$203.889

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DigiKey Marketplace

USA . 309 parts In-Stock

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$206.680

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Vyrian

USA . 7,787 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 561 parts In-Stock

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$18.426

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Corohmni

South Africa . 213 parts In-Stock

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$60.508

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Parana Technologies

USA . 1,959 parts In-Stock

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$62.593

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DigiPath Technology Company

USA . 2,024 parts In-Stock

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$68.922

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$63.409

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$68.922

$63.409

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ChromeModa Solutions

Germany . 2,116 parts In-Stock

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$70.329

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$57.670

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$70.329

$57.670

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

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$70.329

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$66.813

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$63.296

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$66.813

$63.296

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Ampacity Inc.

Singapore . 162 parts In-Stock

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$182.430

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$182.430

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Semicontronic

India . 162 parts In-Stock

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$182.430

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$177.869

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$176.957

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Continental Prestige Electronics

USA . 2,219 parts In-Stock

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$193.020

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$189.160

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$189.160

Corphita

USA . 845 parts In-Stock

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Microchip USA

USA . 1,393 parts In-Stock

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Argo Parts USA

USA . 2,438 parts In-Stock

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Bastille Electronics

Australia . 150 parts In-Stock

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Fairview Electronics Ltd

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Overview

Experience the power of cutting-edge technology with the TMS32C6416EGLZ7E3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are versatile and efficient. Whether you're in telecommunications, audio processing, or industrial control, this DSP offers unmatched performance and reliability. With integrated cache, low power mode, and multiple DMA channels, this product provides exceptional value and benefits to meet all your application needs. Upgrade your projects with the TMS32C6416EGLZ7E3 and unleash its full potential today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components, providing a good balance of strength, durability, and insulation for the DSP.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the DSP by storing frequently accessed data closer to the processor for quicker retrieval.

Maximum Supply Voltage: 1.44 V

With a relatively high maximum supply voltage, this DSP can handle higher power levels and operate efficiently under varying voltage conditions.

Address Bus Width: 32

A wider address bus allows for larger memory addressing capabilities, enabling the DSP to handle complex algorithms and data processing.

Package Shape: SQUARE

The square package shape helps with efficient placement and routing of the DSP on a circuit board, optimizing space utilization.

Bit Size: 32

Operating with a 32-bit architecture allows the DSP to handle larger data sets and perform calculations with higher precision.

Power Supplies (V): 1.4,3.3

Supporting multiple power supply voltages offers flexibility in design and compatibility with various systems and power sources.

No. of Terminals: 532

Having a high number of terminals enables a greater level of connectivity for peripherals and external devices, enhancing the versatility of the DSP.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

These package styles provide options for efficient heat dissipation, secure mounting, and compatibility with modern assembly techniques.

Minimum Supply Voltage: 1.36 V

The low minimum supply voltage ensures that the DSP can operate effectively even under low-power conditions, improving energy efficiency.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP is suitable for use in demanding environments where heat dissipation is crucial.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to respond quickly to external events and prioritize tasks effectively.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the DSP can function reliably in colder environments without risking damage.

Terminal Finish: Tin/Lead (Sn/Pb)

This finish provides good solderability and conductivity for the terminals, ensuring reliable connections in the assembly process.

Terminal Position: BOTTOM

A bottom terminal position simplifies the integration of the DSP into the circuit board layout and facilitates easy access for soldering.

Maximum Seated Height: 3.3 mm

The relatively low maximum seated height allows for a compact design when mounting the DSP on a circuit board, saving space in the overall system.

RAM Words: 16384

Having a large RAM capacity enables the DSP to efficiently store and access data during processing, improving overall performance.

Width: 23 mm

With a moderate width, this DSP can be easily integrated into various electronic devices and systems without taking up excessive space.

Boundary Scan: YES

Supporting boundary scan technology simplifies testing and debugging processes during manufacturing and maintenance, ensuring quality control.

External Data Bus Width: 64

A wider external data bus allows for faster data transfer between the DSP and external devices, enhancing overall system efficiency.

Maximum Clock Frequency: 75.18 MHz

Operating at a high clock frequency enables the DSP to perform computations quickly and handle real-time processing tasks effectively.

Peak Reflow Temperature °C: 220

With a high peak reflow temperature, this DSP can withstand the soldering process during assembly without impacting performance or reliability.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data routing and parallel processing within the DSP, enhancing computational capabilities.

Length: 23 mm

With a moderate length, this DSP can be effectively integrated into various electronic systems without compromising on performance or functionality.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting various peripheral IC types enhances the compatibility and versatility of the DSP for interfacing with different external devices and systems.

No. of Timers: 3

Having multiple timers enables the DSP to synchronize tasks, handle time-sensitive operations, and optimize system performance based on timing requirements.

Technology: CMOS

Operating on CMOS technology offers low power consumption, high noise immunity, and reliable performance, making this DSP suitable for a wide range of applications.

Terminal Form: BALL

A ball terminal form simplifies the soldering and mounting process, ensuring secure connections and reliable performance in the assembly of the DSP.

Nominal Supply Voltage: 1.4 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the DSP within the specified voltage range, minimizing the risk of voltage-related issues.

No. of DMA Channels: 64

Supporting a high number of DMA channels enables efficient data transfer and processing, reducing the workload on the CPU and improving overall system performance.

Terminal Pitch: 0.8 mm

With a small terminal pitch, this DSP can be densely packed on a circuit board, maximizing component density and optimizing space utilization in compact designs.

Format: FIXED POINT

Operating in fixed-point format enhances computational efficiency and simplifies mathematical operations, making this DSP suitable for various signal processing applications.

Moisture Sensitivity Level (MSL): 4

Having a moderate moisture sensitivity level ensures that the DSP can withstand typical environmental conditions during storage, handling, and manufacturing processes.

Low Power Mode: YES

Supporting a low power mode enhances energy efficiency and prolongs battery life in portable devices, making this DSP a cost-effective and sustainable choice for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EGLZ7E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EGLZ7E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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