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DSPIC33FJ16MC102-I/SS

Microchip Technology

DSPIC33FJ16MC102-I/SS by Microchip Technology

DSPIC33FJ16MC102-I/SS by Microchip is a 16-bit DSP with max clock freq of 32MHz. It operates in industrial temp range (-40 to 85°C) and has flash ROM programmability. Suitable for digital signal processing applications, it features a small outline package with 28 terminals and dual terminal position.

Median Price

$2.248

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,591 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Bristol Electronics

USA . 182 parts In-Stock

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$2.248

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$2.087

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182

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$2.248

$2.087

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$11.748

100+ parts

$11.630

1k+ parts

$11.160

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$11.748

$11.630

$11.160

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Corohmni

South Africa . 401 parts In-Stock

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$16.374

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401

$16.374

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AZTECH Wire

Italy . 224 parts In-Stock

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$17.557

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224

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Aztec Data Supply Inc.

USA . 4,690 parts In-Stock

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$35.090

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Lixinc

USA . 14,830 parts In-Stock

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Continental Prestige Electronics

USA . 6,746 parts In-Stock

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Marpe Global Electronics

Taiwan . 5,564 parts In-Stock

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QualityLine Systems

Poland . 5,564 parts In-Stock

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XL Components Corporation

Australia . 5,564 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Argo Parts USA

USA . 758 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Perfect Parts

USA . 39 parts In-Stock

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Overview

Unlock the power of digital signal processing with the Microchip Technology DSPIC33FJ16MC102-I/SS. This top-quality product offers unmatched performance and reliability, backed by the reputation of a leading manufacturer in the industry. Perfect for a wide range of applications, this digital signal processor provides exceptional value and benefits to customers looking for cutting-edge technology. Experience the advantages of high-speed processing, efficient operation, and versatile functionality with the DSPIC33FJ16MC102-I/SS - your ultimate solution for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in design and usage.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on circuit boards, maximizing component density.

Bit Size: 16

The 16-bit size offers high processing capabilities, making the product suitable for advanced digital signal processing tasks.

No. of Terminals: 28

The ample number of terminals enables the product to interface with various external components, expanding its functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style conserves space and enhances portability, ideal for compact devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement enhances power efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliability in diverse settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability allows the product to function in cold environments without performance degradation.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ16MC102-I/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

16

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.3 mm

Trade Compliance

DSPIC33FJ16MC102-I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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