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DSPIC33EP64MC202-E/SSVAO

Microchip Technology

DSPIC33EP64MC202-E/SSVAO by Microchip Technology

DSPIC33EP64MC202-E/SSVAO by Microchip Technology is a 16-bit digital signal processor with 8192 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 3.3V nominal voltage, AEC-Q100 screening level, and flash ROM programmability.

Median Price

$3.750

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,888 parts In-Stock

1+ parts

$3.750

100+ parts

$3.110

1k+ parts

$2.860

10k+ parts

$2.730

4,888

$3.750

$3.110

$2.860

$2.730

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,466

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,826 parts In-Stock

1+ parts

$3.190

100+ parts

-

1k+ parts

-

10k+ parts

-

4,826

$3.190

-

-

-

Corohmni

South Africa . 27 parts In-Stock

1+ parts

$27.467

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$27.467

-

-

-

Aztec Data Supply Inc.

USA . 4,963 parts In-Stock

1+ parts

$81.060

100+ parts

-

1k+ parts

-

10k+ parts

-

4,963

$81.060

-

-

-

Continental Prestige Electronics

USA . 2,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,840

-

-

-

-

Argo Parts USA

USA . 2,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,618

-

-

-

-

Fulton Briggs Corp.

USA . 2,318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,318

-

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the DSPIC33EP64MC202-E/SSVAO by Microchip Technology. As a leader in digital signal processors, Microchip ensures top-notch quality and reliability for all its products. This versatile DSP is perfect for automotive applications, offering high performance and low power consumption. Experience seamless integration, fast processing speeds, and unparalleled efficiency with this innovative product. Upgrade your projects today and discover the endless possibilities with the DSPIC33EP64MC202-E/SSVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Can accommodate a wide range of power supply requirements.

On Chip Data RAM Width: 8

Provides ample memory capacity for processing data efficiently.

No. of Terminals: 28

Offers flexibility for connecting to other components in the system.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold environments.

RAM Words: 8192

Provides a large memory space for storing and accessing data.

Maximum Clock Frequency: 60 MHz

Enables fast processing of signals and data.

Technology: CMOS

Utilizes low power consumption and high noise immunity.

ROM Programmability: FLASH

Allows for easy reprogramming of the on-chip ROM.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP64MC202-E/SSVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

2 mm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

DSPIC33EP64MC202-E/SSVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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