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TMS320C6720BRFP200

Texas Instruments

TMS320C6720BRFP200 by Texas Instruments

TMS320C6720BRFP200 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 25 MHz, suitable for digital signal processing applications requiring high-speed performance in a compact package. The device features multiple internal bus architecture and 65536 RAM words, making it ideal for real-time signal processing tasks.

Median Price

$16.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,620 parts In-Stock

1+ parts

$11.393

100+ parts

$9.951

1k+ parts

$6.863

10k+ parts

-

5,620

$11.393

$9.951

$6.863

-

DigiKey

USA . 55 parts In-Stock

1+ parts

$16.980

100+ parts

-

1k+ parts

-

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55

$16.980

-

-

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Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$16.980

100+ parts

-

1k+ parts

$12.200

10k+ parts

-

37

$16.980

-

$12.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.358

100+ parts

-

1k+ parts

-

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-

50

$9.358

-

-

-

Digiode

USA . 1,877 parts In-Stock

1+ parts

$10.823

100+ parts

-

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-

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1,877

$10.823

-

-

-

Vyrian

USA . 4,080 parts In-Stock

1+ parts

-

100+ parts

-

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4,080

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-

-

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Cyclops Electronics Ltd

UK . 360 parts In-Stock

1+ parts

-

100+ parts

-

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360

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,737 parts In-Stock

1+ parts

$9.358

100+ parts

-

1k+ parts

-

10k+ parts

$9.171

2,737

$9.358

-

-

$9.171

Semicontronic

India . 1,841 parts In-Stock

1+ parts

$9.680

100+ parts

$9.438

1k+ parts

$9.390

10k+ parts

-

1,841

$9.680

$9.438

$9.390

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Ampacity Inc.

Singapore . 1,458 parts In-Stock

1+ parts

$9.680

100+ parts

-

1k+ parts

-

10k+ parts

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1,458

$9.680

-

-

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Corphita

USA . 4,933 parts In-Stock

1+ parts

$10.254

100+ parts

-

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-

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4,933

$10.254

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-

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Corohmni

South Africa . 248 parts In-Stock

1+ parts

$58.515

100+ parts

-

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248

$58.515

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Parana Technologies

USA . 356 parts In-Stock

1+ parts

$71.707

100+ parts

-

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356

$71.707

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DigiPath Technology Company

USA . 565 parts In-Stock

1+ parts

$78.959

100+ parts

$72.642

1k+ parts

-

10k+ parts

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565

$78.959

$72.642

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ChromeModa Solutions

Germany . 1,058 parts In-Stock

1+ parts

$80.570

100+ parts

$66.067

1k+ parts

-

10k+ parts

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1,058

$80.570

$66.067

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IDEA Electronic Components Group

UK . 142 parts In-Stock

1+ parts

$80.570

100+ parts

$76.542

1k+ parts

$72.513

10k+ parts

-

142

$80.570

$76.542

$72.513

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Lixinc

USA . 10,850 parts In-Stock

1+ parts

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10,850

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Argo Parts USA

USA . 3,224 parts In-Stock

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3,224

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S.R.D Solutions

India . 2,000 parts In-Stock

1+ parts

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2,000

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A-Z Elektronik GmbH

Germany . 1,400 parts In-Stock

1+ parts

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1,400

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$9.171

1k+ parts

$8.891

10k+ parts

$8.703

50

-

$9.171

$8.891

$8.703

Overview

Unlock the power of high-quality digital signal processing with the TMS320C6720BRFP200 by Texas Instruments. Designed with advanced technology and expertise, this DSP offers seamless integration, efficient performance, and versatile applications. From audio processing to telecommunications, this product provides exceptional value and benefits for customers seeking top-notch solutions. Experience the advantages of Texas Instruments' innovation and reliability with the TMS320C6720BRFP200.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Integrated Cache:

YES - Enhances processing speed and efficiency.

Surface Mount:

YES - Allows for easy integration on PCBs.

Maximum Supply Voltage:

1.32 V - Ensures safe and reliable operation.

On Chip Data RAM Width:

8 - Allows for efficient data processing.

Address Bus Width:

32 - Supports high-speed data transfer.

Package Shape:

SQUARE - Easy to handle and provides efficient PCB utilization.

Bit Size:

32 - Ideal for high-performance computing tasks.

Power Supplies (V):

1.2,3.3 - Offers flexibility in power requirements.

No. of Terminals:

144 - Provides ample connectivity options.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - Enables compact and space-saving designs.

Minimum Supply Voltage:

1.14 V - Allows for lower power consumption.

Maximum Operating Temperature:

90 °C - Ensures reliability under varying conditions.

Minimum Operating Temperature:

0 °C - Suitable for a wide range of environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures good electrical conductivity.

Terminal Position:

QUAD - Provides stability during installation.

Maximum Seated Height:

1.2 mm - Enables compact device packaging.

RAM Words:

65536 - Sufficient memory for data storage and processing.

Width:

20 mm - Compact form factor for easy integration.

Boundary Scan:

YES - Facilitates testing and debugging.

External Data Bus Width:

32 - Supports high-speed external data transfer.

Maximum Clock Frequency:

25 MHz - Allows for fast data processing.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Suitable for lead-free soldering processes.

Internal Bus Architecture:

MULTIPLE - Enhances data flow within the processor.

Length:

20 mm - Compact size for versatile applications.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Provides flexibility in connectivity options.

Technology:

CMOS - Offers low power consumption and high speed.

Terminal Form:

GULL WING - Ensures secure solder joints.

Nominal Supply Voltage:

1.2 V - Supports reliable operation.

No. of DMA Channels:

16 - Enables efficient data transfer.

ROM Programmability:

MROM - Provides secure storage for critical data.

Terminal Pitch:

0.5 mm - Enables high-density PCB designs.

Format:

FLOATING POINT - Supports complex numerical calculations.

Moisture Sensitivity Level (MSL):

4 - Suitable for a variety of operating environments.

On Chip Program ROM Width:

8 - Ideal for storing program code efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6720BRFP200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of Terminals:

144

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320C6720BRFP200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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