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MC56F8355MFGE

NXP Semiconductors

MC56F8355MFGE by NXP Semiconductors

MC56F8355MFGE by NXP Semiconductors is a 16-bit DSP with 262144 ROM words, operating at up to 120 MHz. Ideal for automotive applications, it features a low profile package with 128 terminals and supports boundary scan testing. With a wide temperature range (-40 to 125 °C), this processor offers power-efficient performance in various digital signal processing tasks.

Median Price

$53.450

Lifecycle Status

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Verical

USA . 288 parts In-Stock

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$41.310

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DigiKey

USA . 136 parts In-Stock

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Avnet

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Digiode

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Nova Conductors

Japan . 900 parts In-Stock

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Vyrian

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Chip Stock

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Flip Electronics

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AZTECH Wire

Italy . 367 parts In-Stock

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$6.004

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Ampacity Inc.

Singapore . 5 parts In-Stock

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Semicontronic

India . 13 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 2,483 parts In-Stock

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$40.900

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Corohmni

South Africa . 70 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Vigor

Singapore . 357 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,770 parts In-Stock

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Microchip USA

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iodParts Technologies Inc.

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Argo Parts USA

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Glotronic Ltd.

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Netroflash

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A-Z Elektronik GmbH

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Overview

Unlock the power of cutting-edge technology with the MC56F8355MFGE by NXP Semiconductors. This top-of-the-line Digital Signal Processor boasts incredible performance, reliability, and versatility, making it the perfect solution for a wide range of applications. Whether you're working on automotive electronics, industrial automation, or consumer electronics, this product delivers unmatched value, efficiency, and precision. Experience seamless operation and exceptional results with the MC56F8355MFGE - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 2.75 V

Operates at a maximum supply voltage of 2.75V, making it energy efficient and suitable for low power applications.

Address Bus Width: 11

With an address bus width of 11, the DSP can efficiently handle data addressing tasks and support complex calculations.

Bit Size: 16

16-bit processing capability provides high precision and accuracy in signal processing tasks.

Power Supplies (V): 2.5, 3.3

Supports multiple power supply options, allowing flexibility in system design and integration.

No. of Terminals: 128

With 128 terminals, there are sufficient connection points for interfacing with other components in the system.

Minimum Supply Voltage: 2.25 V

Allows for operation at low supply voltages, enabling power-efficient performance in various applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for harsh environments and automotive applications.

CPU Family: 56800E

Belongs to the 56800E CPU family, known for its efficient processing capabilities and performance in DSP applications.

Minimum Operating Temperature: -40 °C

Can operate at extremely low temperatures, making it suitable for use in freezing environments.

Terminal Finish: TIN

Tin terminal finish provides reliable connections and ensures good signal conductivity.

ROM Words: 262144

Large ROM capacity allows for storage of a significant amount of data and program code, enhancing device functionality.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6mm saves space and enables compact system integration.

Width: 14 mm

Compact width of 14mm makes the DSP suitable for applications with space constraints.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during manufacturing and maintenance.

External Data Bus Width: 4

With an external data bus width of 4, the DSP can efficiently handle data transfer tasks and support high-speed communication.

Maximum Clock Frequency: 120 MHz

High clock frequency of 120MHz enables fast processing speeds and real-time signal processing capabilities.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring reliability during manufacturing processes.

RAM Bytes: 20480

With 20480 bytes of RAM, the DSP can store and process large amounts of data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during PCB assembly.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible programming of the device, enhancing its versatility.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures reliability in humid or moisture-prone environments.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and extends the battery life in portable devices.

Barrel Shifter: YES

Barrel shifter capability helps in shifting and rotating bits efficiently, enhancing the DSP's processing speed and flexibility.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8355MFGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

11

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

4

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC56F8355MFGE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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