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DSPIC33EP256GP502-I/MM

Microchip Technology

DSPIC33EP256GP502-I/MM by Microchip Technology

DSPIC33EP256GP502-I/MM by Microchip Technology is a 16-bit DSP with 3.6V max supply voltage, operating at up to 60MHz. Ideal for industrial applications, it features 32768 RAM words, FLASH ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$4.590

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 488 parts In-Stock

1+ parts

$4.590

100+ parts

$3.820

1k+ parts

$3.500

10k+ parts

$3.320

488

$4.590

$3.820

$3.500

$3.320

DigiKey

USA . 144 parts In-Stock

1+ parts

$4.590

100+ parts

$3.820

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-

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144

$4.590

$3.820

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Mouser Electronics

USA . 44 parts In-Stock

1+ parts

$4.590

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$3.820

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44

$4.590

$3.820

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Master Electronics

USA . 214 parts In-Stock

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-

100+ parts

$4.370

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$4.000

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214

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$4.370

$4.000

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Verical

USA . 210 parts In-Stock

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210

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.393

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10

$4.393

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Chip Stock

USA . 4,917 parts In-Stock

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4,917

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Vyrian

USA . 823 parts In-Stock

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823

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IBS Electronics

USA . 214 parts In-Stock

1+ parts

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100+ parts

$6.129

1k+ parts

$5.610

10k+ parts

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214

-

$6.129

$5.610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 957 parts In-Stock

1+ parts

$3.400

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957

$3.400

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Semicontronic

India . 696 parts In-Stock

1+ parts

$3.400

100+ parts

$3.315

1k+ parts

$3.298

10k+ parts

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696

$3.400

$3.315

$3.298

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Continental Prestige Electronics

USA . 4,168 parts In-Stock

1+ parts

$4.393

100+ parts

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10k+ parts

$4.305

4,168

$4.393

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$4.305

Argo Parts USA

USA . 2,264 parts In-Stock

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$4.393

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2,264

$4.393

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Corohmni

South Africa . 104 parts In-Stock

1+ parts

$22.372

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104

$22.372

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Aztec Data Supply Inc.

USA . 788 parts In-Stock

1+ parts

$24.700

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788

$24.700

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Advanced Electronics

New Zealand . 77 parts In-Stock

1+ parts

$71.776

100+ parts

$68.187

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$68.187

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77

$71.776

$68.187

$68.187

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Lixinc

USA . 11,827 parts In-Stock

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RGB Technical Solutions

Ukraine . 3,740 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the Microchip Technology DSPIC33EP256GP502-I/MM. This cutting-edge digital signal processor offers unparalleled quality and reliability, backed by Microchip's renowned reputation in the industry. Perfect for a range of applications in areas such as industrial automation, automotive, and consumer electronics, this DSP provides exceptional value with its high performance and low power consumption. Experience the benefits of seamless integration, efficient operation, and reliable performance with the DSPIC33EP256GP502-I/MM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, the product can handle a wider range of power inputs, offering flexibility in design and operation.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and handling, improving overall performance.

Screening Level: TS 16949

This screening level ensures high quality and reliability, meeting automotive industry standards for robustness and durability.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space and makes it easier to design compact and densely populated circuits.

Bit Size: 16

A 16-bit architecture provides higher accuracy and precision in signal processing, making the product suitable for demanding applications.

Power Supplies (V): 3.3

The specified power supply voltage ensures compatibility with common power sources, making integration into existing systems easier.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and integration with external components, enhancing versatility.

Minimum Supply Voltage: 3 V

The specified minimum supply voltage ensures reliable operation even under lower power conditions, increasing the product's robustness.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures, making it suitable for industrial and automotive applications.

No. of External Interrupts: 3

Having multiple external interrupts allows the processor to respond quickly to external events, improving real-time performance and responsiveness.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product can operate reliably in harsh environments or in cold conditions without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: QUAD

The Quad terminal position allows for easy connectivity and mounting on circuit boards, facilitating efficient assembly and maintenance.

Maximum Seated Height: 1 mm

With a low maximum seated height, the product can be integrated into slim and compact devices, optimizing space utilization in designs.

RAM Words: 32768

Having a large RAM capacity allows for more data storage and processing capabilities, enabling complex signal processing tasks and algorithms.

Width: 6 mm

The compact width of the product makes it suitable for space-constrained designs and applications where size and form factor are important considerations.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during production, ensuring quality and reducing time-to-market.

Maximum Clock Frequency: 60 MHz

With a high maximum clock frequency, the product can perform fast signal processing and computations, meeting the demands of real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The specified maximum time at peak reflow temperature ensures proper soldering and assembly processes, preventing damage to the product during manufacturing.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without degradation or damage, ensuring reliable solder joints.

Length: 6 mm

The compact length of the product contributes to its overall small form factor, making it suitable for miniaturized designs and compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature variations, making the product suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining digital signal processing and controller functionalities in one IC enhances the product's versatility and applicability in a wide range of applications.

No. of Timers: 5

Having multiple timers allows for precise timing control and synchronization of operations, enhancing the product's capabilities in time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of soldering defects, contributing to the overall reliability of the product.

Maximum Supply Current: 55 mA

With a moderate maximum supply current, the product consumes less power during operation, leading to energy efficiency and extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage ensures stable and consistent operation, preventing voltage fluctuations that could affect the product's performance.

No. of DMA Channels: 4

Having multiple DMA channels enables efficient data transfer and communication between peripherals and memory, improving overall system performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, enhancing the product's versatility and adaptability to changing requirements.

Terminal Pitch: 0.65 mm

The specified terminal pitch enables high-density mounting of the product on circuit boards, optimizing space utilization and enabling compact designs.

Format: FIXED POINT

The fixed-point format simplifies signal processing algorithms and computations, reducing complexity and improving computational efficiency in the product.

Low Power Mode: YES

The low power mode feature allows the product to operate in a power-efficient mode, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

Having a wide on-chip program ROM width enables the storage of complex algorithms and firmware, enhancing the product's processing capabilities and versatility.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256GP502-I/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33EP256GP502-I/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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