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TMS320VC5509AGHHAU

Texas Instruments

TMS320VC5509AGHHAU by Texas Instruments

TMS320VC5509AGHHAU by Texas Instruments is a 16-bit DSP with 50 MHz clock frequency, ideal for industrial applications. Features include 21-bit address bus, 16-bit external data bus, and low power mode. Its grid array package with 179 terminals makes it suitable for digital signal processing tasks in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,021 parts In-Stock

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Digiode

USA . 4,855 parts In-Stock

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Nova Conductors

Japan . 55 parts In-Stock

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AZTECH Wire

Italy . 264 parts In-Stock

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$15.572

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One Stop Electronics

USA . 236 parts In-Stock

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$17.000

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Semicontronic

India . 392 parts In-Stock

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$21.000

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$20.475

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$20.370

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$20.370

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Ampacity Inc.

Singapore . 754 parts In-Stock

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$29.000

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Corohmni

South Africa . 5,121 parts In-Stock

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$38.722

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$51.205

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$48.645

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Parana Technologies

USA . 1,723 parts In-Stock

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$67.919

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DigiPath Technology Company

USA . 2,284 parts In-Stock

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$74.787

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ChromeModa Solutions

Germany . 1,070 parts In-Stock

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$76.313

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IDEA Electronic Components Group

UK . 581 parts In-Stock

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Continental Prestige Electronics

USA . 4,774 parts In-Stock

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Corphita

USA . 2,791 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock the power of innovation with the TMS320VC5509AGHHAU by Texas Instruments, a cutting-edge Digital Signal Processor designed to enhance performance and efficiency in a wide range of applications. With Texas Instruments' reputation for quality and reliability, this DSP offers unparalleled value and benefits to customers seeking high-quality audio processing, telecommunications, and industrial control solutions. Experience the advantage of advanced technology and seamless integration with the TMS320VC5509AGHHAU, delivering superior performance and flexibility for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the DSP, saving space on the PCB.

Maximum Supply Voltage: 1.65 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Address Bus Width: 21

The wide address bus width allows for efficient communication and data transfer within the DSP.

Package Shape: SQUARE

The square package shape makes it easy to align and mount the DSP on the PCB.

No. of Terminals: 179

The high number of terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with a low profile and fine pitch design allows for high-density mounting and reliable connections.

Minimum Supply Voltage: 1.55 V

The low minimum supply voltage helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the DSP can function in a wide range of temperature settings.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the DSP into the system.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact design and helps in saving space in the overall system.

Width: 12 mm

The compact width of the DSP enables easy integration into smaller electronic devices or systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 16

The external data bus width of 16 bits enables fast data transfer and processing within the DSP.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for rapid signal processing and execution of complex algorithms.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing speed within the DSP, improving overall performance.

Length: 12 mm

The compact length of the DSP makes it suitable for space-constrained applications or devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and operation in industrial settings with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP is designed for digital signal processing applications and supports a variety of peripheral ICs for enhanced functionality.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high-speed operation, making the DSP energy-efficient and fast.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and simplifies the mounting process of the DSP on the PCB.

Nominal Supply Voltage: 1.6 V

The nominal supply voltage of 1.6 V ensures stable and consistent power supply to the DSP for reliable performance.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8 mm enables high-density mounting of the DSP on the PCB, saving space and improving efficiency.

Format: FIXED POINT

The fixed-point format simplifies numerical calculations and processing within the DSP, making it suitable for a wide range of applications.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low-load scenarios, improving overall energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AGHHAU attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

179

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5509AGHHAU Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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