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DSPIC33CK512MP608-H/PT

Microchip Technology

DSPIC33CK512MP608-H/PT by Microchip Technology

DSPIC33CK512MP608-H/PT by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 65536 RAM words, and 8 DMA channels. It is used in digital signal processing applications requiring low power mode and AEC-Q100 screening for automotive environments.

Median Price

$5.550

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$5.550

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500

$5.550

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Vyrian

USA . 501 parts In-Stock

1+ parts

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501

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,486 parts In-Stock

1+ parts

$5.550

100+ parts

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1k+ parts

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10k+ parts

$5.439

5,486

$5.550

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$5.439

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.550

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$5.550

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AZTECH Wire

Italy . 726 parts In-Stock

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$7.299

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726

$7.299

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Ampacity Inc.

Singapore . 1,354 parts In-Stock

1+ parts

$20.000

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1,354

$20.000

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Aztec Data Supply Inc.

USA . 7,247 parts In-Stock

1+ parts

$63.680

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7,247

$63.680

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Corohmni

South Africa . 664 parts In-Stock

1+ parts

$76.055

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664

$76.055

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Marpe Global Electronics

Taiwan . 7,472 parts In-Stock

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QualityLine Systems

Poland . 7,472 parts In-Stock

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7,472

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XL Components Corporation

Australia . 7,472 parts In-Stock

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Argo Parts USA

USA . 3,363 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33CK512MP608-H/PT from industry leader Microchip Technology. This versatile digital signal processor offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're designing automotive systems, industrial controls, or consumer electronics, this DSP provides the perfect balance of speed, efficiency, and flexibility. Trust in Microchip's reputation for quality and innovation, and experience the difference with the DSPIC33CK512MP608-H/PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, making it suitable for a variety of applications.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for stable operation within a safe voltage range.

On Chip Data RAM Width: 8

Enables efficient data processing and storage capabilities.

Screening Level: AEC-Q100

Meets stringent automotive industry standards for reliability and performance.

Package Shape: SQUARE

Compact shape for efficient use of board space.

Bit Size: 16

Provides high computational power for complex signal processing tasks.

No. of Terminals: 80

Offers ample connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Streamlined package design for space-constrained applications.

Minimum Supply Voltage: 3 V

Ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 150 °C

Capable of withstanding high temperatures in industrial environments.

No. of External Interrupts: 4

Allows for efficient handling of external events and real-time processing.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Terminal Position: QUAD

Simplifies PCB layout and connectivity arrangements.

Maximum Seated Height: 1.2 mm

Low profile design for compact system integration.

RAM Words: 65536

Offers ample memory capacity for data storage and processing.

Width: 12 mm

Slim form factor for versatile placement within electronic devices.

Boundary Scan: YES

Facilitates testing and debugging during production and maintenance.

Maximum Clock Frequency: 64 MHz

Provides high-speed processing capabilities for real-time applications.

Internal Bus Architecture: MULTIPLE

Enables efficient data transfer and communication within the processor.

Length: 12 mm

Compact dimensions for space-efficient system design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile functionality for signal processing and control applications.

Technology: CMOS

Energy-efficient design for low power consumption and heat generation.

Terminal Form: GULL WING

Facilitates soldering and PCB mounting for secure connections.

Maximum Supply Current: 42 mA

Efficient power consumption for extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with a wide range of components.

No. of DMA Channels: 8

Enables high-speed data transfer and processing capabilities.

ROM Programmability: FLASH

Allows for flexibility in programming and updating firmware.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density board layouts and connectivity.

Format: FIXED POINT

Suitable for applications requiring precise numerical calculations.

Low Power Mode: YES

Enables power-saving operation for extended battery life in portable devices.

Barrel Shifter: YES

Enhances computational efficiency for complex algorithms and data manipulation.

On Chip Program ROM Width: 8

Efficient storage of program code for streamlined execution.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK512MP608-H/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

4

No. of Terminals:

80

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

DSPIC33CK512MP608-H/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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