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DSPIC33CK32MC102T-I/M6

Microchip Technology

DSPIC33CK32MC102T-I/M6 by Microchip Technology

DSPIC33CK32MC102T-I/M6 by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 3.3V supply voltage, and 8192 RAM words. Ideal for industrial applications, it features low power mode, flash ROM programmability, and 4 DMA channels for efficient data processing in digital signal processing tasks.

Median Price

$1.969

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$1.969

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32

$1.969

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Vyrian

USA . 1,240 parts In-Stock

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1,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,321 parts In-Stock

1+ parts

$1.969

100+ parts

-

1k+ parts

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10k+ parts

$1.930

3,321

$1.969

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$1.930

Argo Parts USA

USA . 3,264 parts In-Stock

1+ parts

$1.969

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3,264

$1.969

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$2.008

100+ parts

$2.008

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$2.008

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700

$2.008

$2.008

$2.008

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Ampacity Inc.

Singapore . 1,623 parts In-Stock

1+ parts

$8.000

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1,623

$8.000

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Corohmni

South Africa . 2,598 parts In-Stock

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$17.136

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2,598

$17.136

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$17.504

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283

$17.504

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Semicontronic

India . 782 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

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782

$20.000

$19.500

$19.400

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Aztec Data Supply Inc.

USA . 271 parts In-Stock

1+ parts

$20.690

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271

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RGB Technical Solutions

Ukraine . 5,284 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$1.930

1k+ parts

$1.871

10k+ parts

$1.831

50

-

$1.930

$1.871

$1.831

Overview

Elevate your projects with the cutting-edge DSPIC33CK32MC102T-I/M6 from Microchip Technology. As a leader in digital signal processors, Microchip ensures top-notch quality and reliability in every product. This DSP is perfect for applications requiring high-speed data processing and precise control. With a maximum clock frequency of 64 MHz and low power mode feature, this chip offers unmatched performance while conserving energy. Say goodbye to limitations and hello to limitless possibilities with the DSPIC33CK32MC102T-I/M6. Unlock the next level of innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and flexibility in design.

Surface Mount: YES

Ease of installation and space-saving design for compact applications.

Maximum Supply Voltage: 3.6 V

Operates efficiently within specified voltage range.

On Chip Data RAM Width: 8

Efficient data processing capability with wider RAM width.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards.

Bit Size: 16

16-bit processing capability for enhanced performance.

No. of Terminals: 28

Sufficient terminals for connectivity options and versatile applications.

Minimum Supply Voltage: 3 V

Operates within a stable voltage range for consistent performance.

Maximum Operating Temperature: 85 °C

High temperature tolerance for reliable operation in various environments.

No. of External Interrupts: 4

Multiple interrupt options for efficient handling of external events.

Minimum Operating Temperature: -40 °C

Low temperature operating capability for extended range of use.

Terminal Position: QUAD

Quad terminal position for convenient connectivity and compact layout.

RAM Words: 8192

Sufficient RAM capacity for storage and processing of data.

Width: 4 mm

Compact width for space-saving design in applications with size constraints.

Boundary Scan: YES

Boundary scan feature for easy testing and debugging of circuits.

Maximum Clock Frequency: 64 MHz

High clock frequency for fast data processing and performance.

Internal Bus Architecture: MULTIPLE

Multiple internal buses for efficient data transfer within the processor.

Length: 4 mm

Compact length for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type suitable for a wide range of applications.

No. of Timers: 3

Multiple timers for accurate timing and synchronization tasks.

Technology: CMOS

CMOS technology for low power consumption and efficient operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental-friendly design.

Maximum Supply Current: 29.6 mA

Efficient use of current for optimized power consumption.

Nominal Supply Voltage: 3.3 V

Stable nominal voltage for reliable and consistent performance.

No. of DMA Channels: 4

Multiple DMA channels for efficient data transfer and processing.

No. of Serial I/Os: 3

Serial I/O options for versatile communication interfaces.

ROM Programmability: FLASH

Programmable ROM for flexible application development and customization.

Terminal Pitch: 0.4 mm

Compact terminal pitch for efficient PCB design and layout.

Format: FIXED POINT

Fixed point format for precision in mathematical calculations.

Low Power Mode: YES

Low power mode option for energy-efficient operation.

Barrel Shifter: YES

Barrel shifter feature for efficient data manipulation and processing.

On Chip Program ROM Width: 24

Wide on-chip ROM width for storage and execution of program code.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK32MC102T-I/M6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Maximum Supply Current:

29.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CK32MC102T-I/M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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