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TMSDC6726BRFPA225

Texas Instruments

TMSDC6726BRFPA225 by Texas Instruments

TMSDC6726BRFPA225 by Texas Instruments is a 32-bit DSP with integrated cache, 262144 RAM words, and 25 MHz max clock frequency. Ideal for industrial applications requiring high-speed data processing, it features a 32-bit external data bus width and operates at temperatures ranging from -40 to 105°C.

Median Price

$33.380

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 60 parts In-Stock

1+ parts

$28.009

100+ parts

$24.466

1k+ parts

$16.873

10k+ parts

-

60

$28.009

$24.466

$16.873

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Mouser Electronics

USA . 815 parts In-Stock

1+ parts

$38.750

100+ parts

$28.430

1k+ parts

$27.130

10k+ parts

-

815

$38.750

$28.430

$27.130

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DigiKey

USA . 36 parts In-Stock

1+ parts

$38.750

100+ parts

$28.448

1k+ parts

$26.710

10k+ parts

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36

$38.750

$28.448

$26.710

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Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$24.250

1k+ parts

$21.700

10k+ parts

$20.420

3

-

$24.250

$21.700

$20.420

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$21.013

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$21.013

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Digiode

USA . 241 parts In-Stock

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$22.258

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-

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$22.258

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Vyrian

USA . 3,186 parts In-Stock

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3,186

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Chip Stock

USA . 1,125 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Atlantic Semiconductor

USA . 2 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,684 parts In-Stock

1+ parts

$19.901

100+ parts

-

1k+ parts

-

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$19.503

5,684

$19.901

-

-

$19.503

Semicontronic

India . 257 parts In-Stock

1+ parts

$19.920

100+ parts

$19.422

1k+ parts

$19.322

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257

$19.920

$19.422

$19.322

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$19.920

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10

$19.920

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$21.013

100+ parts

-

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$19.962

10k+ parts

$19.542

2,000

$21.013

-

$19.962

$19.542

Corphita

USA . 1,768 parts In-Stock

1+ parts

$21.087

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$21.087

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Corohmni

South Africa . 2,587 parts In-Stock

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$35.308

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$35.308

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$58.240

100+ parts

$52.998

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$47.757

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$58.240

$52.998

$47.757

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Parana Technologies

USA . 983 parts In-Stock

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$61.376

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983

$61.376

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DigiPath Technology Company

USA . 1,117 parts In-Stock

1+ parts

$67.583

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$62.176

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1,117

$67.583

$62.176

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IDEA Electronic Components Group

UK . 2,173 parts In-Stock

1+ parts

$68.962

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$65.514

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$62.066

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2,173

$68.962

$65.514

$62.066

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ChromeModa Solutions

Germany . 1,897 parts In-Stock

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$68.962

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$56.549

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Lixinc

USA . 13,552 parts In-Stock

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iodParts Technologies Inc.

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Alle Elektronik GmbH

Germany . 4,562 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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950

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Overview

Experience unparalleled performance and efficiency with the TMSDC6726BRFPA225 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are ideal for a wide range of applications. With integrated cache and advanced features, this product offers unmatched value and benefits to customers. Whether you're working on audio processing, telecommunications, or industrial control systems, the TMSDC6726BRFPA225 is the perfect solution for your needs. Trust Texas Instruments to provide reliable and innovative technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making it a suitable choice for packaging digital signal processors.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the digital signal processor by reducing memory access times and increasing data processing speed.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V allows for efficient power management and provides enough power for the device to operate effectively.

Bit Size: 32

A 32-bit architecture allows for processing large amounts of data quickly and efficiently, making this digital signal processor suitable for handling complex computational tasks.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures that the digital signal processor can function reliably in industrial environments where temperature conditions may vary.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor specifically designed for processing digital signals, this product is optimized for high-speed data processing and efficient signal manipulation tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMSDC6726BRFPA225 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of Terminals:

144

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMSDC6726BRFPA225 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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