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TMSDVC5510AGBCA2

Texas Instruments

TMSDVC5510AGBCA2 by Texas Instruments

TMSDVC5510AGBCA2 by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 200 MHz. Ideal for industrial applications, it features integrated cache, 163840 RAM words, and low power mode for efficient processing.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,979 parts In-Stock

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Digiode

USA . 281 parts In-Stock

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281

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AZTECH Wire

Italy . 304 parts In-Stock

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$15.614

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304

$15.614

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One Stop Electronics

USA . 1,185 parts In-Stock

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$23.000

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Corohmni

South Africa . 3,043 parts In-Stock

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$29.564

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Parana Technologies

USA . 1,460 parts In-Stock

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$62.509

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$62.509

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DigiPath Technology Company

USA . 1,862 parts In-Stock

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$68.830

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$63.324

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$68.830

$63.324

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ChromeModa Solutions

Germany . 6,387 parts In-Stock

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$70.235

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$57.593

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$57.593

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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$70.235

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$66.723

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$63.212

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Microchip USA

USA . 977 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the TMSDVC5510AGBCA2 by Texas Instruments. As a leading manufacturer in the industry of Digital Signal Processors, Texas Instruments consistently delivers top-quality products that set the standard for excellence. From enhancing audio and video processing to optimizing communications systems, this DSP offers unparalleled performance and reliability. Elevate your projects with the advantages of integrated cache, advanced architecture, and low power mode. Experience the value and benefits of Texas Instruments' expertise with the TMSDVC5510AGBCA2 - where innovation meets perfection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Integrated Cache: YES

The integrated cache helps improve processing speed by storing frequently accessed data and instructions.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB.

Maximum Supply Voltage: 1.65 V

This voltage allows for efficient power consumption while providing enough power for high performance.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for faster data processing and manipulation.

Address Bus Width: 22

A wider address bus width enables the processor to access a larger memory space efficiently.

Package Shape: SQUARE

The square package shape makes it easier to mount and align on the PCB.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data in smaller chunks.

No. of Terminals: 240

Having a higher number of terminals allows for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style is ideal for space-constrained applications and provides a reliable connection.

Minimum Supply Voltage: 1.55 V

This lower voltage threshold ensures compatibility with various power sources while maintaining stability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

No. of External Interrupts: 6

Multiple external interrupts enable the processor to respond to external events quickly and efficiently.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Finish: TIN LEAD

The tin-lead finish provides good solderability and ensures a reliable electrical connection.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and routing of traces.

Maximum Seated Height: 1.4 mm

The low seated height allows for a slim and compact overall design.

RAM Words: 163840

Having a large RAM capacity enables the processor to handle complex algorithms and large data sets efficiently.

Width: 15 mm

The compact width of the product allows for space-saving integration into various electronic devices.

Boundary Scan: YES

Boundary scan support helps with testing, debugging, and diagnosing potential issues in the product.

External Data Bus Width: 32

A wider external data bus width allows for faster data transfer between the processor and external devices.

Maximum Clock Frequency: 200 MHz

The high clock frequency enables fast processing speeds and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 20

The short reflow time ensures that the product is not exposed to excessive heat for too long during manufacturing.

Peak Reflow Temperature °C: 220

The high peak reflow temperature allows for reliable solder joints during the assembly process.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the processor for improved performance.

Length: 15 mm

The compact length of the product complements its width, making it suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates that the product is specifically designed for DSP applications, offering optimized performance.

No. of Timers: 2

Having multiple timers allows for accurate timing and synchronization in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances overall reliability.

Maximum Supply Current: 112 mA

The low supply current helps minimize power consumption and heat generation during operation.

Nominal Supply Voltage: 1.6 V

The nominal voltage ensures stable and efficient operation of the product within the specified voltage range.

No. of DMA Channels: 6

Having multiple DMA channels allows for efficient data transfer between memory and peripherals without processor intervention.

ROM Programmability: MROM

Mask-programmable ROM provides secure and fixed program storage, ideal for firmware and software updates.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and precise connections on the PCB.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and accelerates processing speed for specific applications.

Moisture Sensitivity Level (MSL): 3

A moderate MSL ensures the product's reliability during storage and handling in various environmental conditions.

Low Power Mode: YES

The low power mode helps conserve energy and extend battery life in portable devices.

On Chip Program ROM Width: 16

The on-chip program ROM width of 16 allows for efficient storage and retrieval of program instructions.

Technical Specifications

Digital Signal Processors (DSPs) TMSDVC5510AGBCA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

112 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMSDVC5510AGBCA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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