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TMSDM642AZDK5TAN

Texas Instruments

TMSDM642AZDK5TAN by Texas Instruments

TMSDM642AZDK5TAN by Texas Instruments is a Digital Signal Processor (DSP) with CMOS technology. It features a peak reflow temperature of 260°C, 30s at peak reflow temp, and Tin Silver Copper terminal finish. Ideal for applications requiring high-performance signal processing in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,012 parts In-Stock

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Digiode

USA . 4,717 parts In-Stock

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4,717

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Distributors (Availability)

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AZTECH Wire

Italy . 890 parts In-Stock

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$13.865

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890

$13.865

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Ampacity Inc.

Singapore . 560 parts In-Stock

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$26.000

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560

$26.000

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Parana Technologies

USA . 2,353 parts In-Stock

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$26.384

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$26.976

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2,353

$26.384

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$26.976

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DigiPath Technology Company

USA . 1,189 parts In-Stock

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$29.052

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1,189

$29.052

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ChromeModa Solutions

Germany . 3,036 parts In-Stock

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$29.645

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$24.309

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3,036

$29.645

$24.309

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IDEA Electronic Components Group

UK . 1,056 parts In-Stock

1+ parts

$29.645

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$28.163

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$26.680

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1,056

$29.645

$28.163

$26.680

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One Stop Electronics

USA . 421 parts In-Stock

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$31.000

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$31.000

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Corohmni

South Africa . 5,186 parts In-Stock

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$81.158

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Microchip USA

USA . 2,460 parts In-Stock

1+ parts

$141.120

100+ parts

$138.660

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$137.440

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$136.210

2,460

$141.120

$138.660

$137.440

$136.210

Corphita

USA . 4,295 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMSDM642AZDK5TAN from Texas Instruments. Known for their high-quality products, Texas Instruments brings you a cutting-edge Digital Signal Processor that opens up endless possibilities in various applications. Whether you're working on audio and speech processing, automotive systems, or telecommunications, this DSP offers unparalleled value, efficiency, and performance. Unlock new opportunities and enhance your projects with the TMSDM642AZDK5TAN.

Feature Benefit Bullets

Terminal Finish: TIN

TIN finish provides excellent solderability and corrosion resistance, ensuring reliable connections and long-lasting performance.

Terminal Finish: SILVER

Silver finish allows for high conductivity, resulting in better signal transmission and overall improved performance.

Terminal Finish: COPPER

Copper finish offers good thermal conductivity, helping in dissipating heat efficiently and maintaining product stability during operation.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds minimizes thermal stress on components during manufacturing, ensuring their integrity and reliability.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper solder melting and joint formation, leading to strong and durable connections.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Advanced digital signal processor technology provides high-speed data processing capabilities, making the product suitable for demanding signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption, enabling energy-efficient operation and extended battery life in portable devices.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the product can withstand exposure to moderate humidity levels, ensuring long-term reliability and performance in various environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) TMSDM642AZDK5TAN attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMSDM642AZDK5TAN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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