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TMS320C6713BZDP300

Texas Instruments

TMS320C6713BZDP300 by Texas Instruments

TMS320C6713BZDP300 by Texas Instruments is a 32-bit DSP with 300 MHz clock frequency, 65536 RAM words, and integrated cache. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Features include 22-bit address bus width, 32-bit external data bus width, and boundary scan capability.

Median Price

$69.800

Lifecycle Status

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1k+

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Texas Instruments

USA . 11,429 parts In-Stock

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$43.874

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Chip1Stop

Japan . 40 parts In-Stock

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$69.800

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$50.300

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$44.300

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Mouser Electronics

USA . 37 parts In-Stock

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$71.980

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$56.210

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$52.890

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$52.890

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Distributors (In-Stock)

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Digiode

USA . 2,546 parts In-Stock

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Nova Conductors

Japan . 75 parts In-Stock

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Chip Stock

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Vyrian

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Cyclops Electronics Ltd

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LWI Electronics Inc

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Sensible Micro Corp

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Zilex Electronics Inc.

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EZ Electronic Parts

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Semi Source

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Atlantic Semiconductor

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Inventory MP

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Belgium . 1 parts In-Stock

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SPM Sales

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LIBRA Elektronik GmbH

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Distributors (Availability)

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Corohmni

South Africa . 64 parts In-Stock

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$40.297

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64

$40.297

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Ampacity Inc.

Singapore . 2,894 parts In-Stock

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$41.950

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Semicontronic

India . 2,517 parts In-Stock

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$41.950

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$40.901

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$40.692

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Corphita

USA . 4,218 parts In-Stock

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Parana Technologies

USA . 2,324 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

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Component Stockers USA

USA . 13,922 parts In-Stock

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$34.400

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ChromeModa Solutions

Germany . 5,427 parts In-Stock

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IDEA Electronic Components Group

UK . 1,958 parts In-Stock

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Lixinc

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Argo Parts USA

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DigiPath Technology Company

USA . 1,450 parts In-Stock

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Perfect Parts

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Lucentia Tech

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GreenTree Electronics

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Kepictronics

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Overview

Unlock the power of advanced signal processing with the TMS320C6713BZDP300 by Texas Instruments. Built with precision and expertise, this Digital Signal Processor offers unparalleled performance for a wide range of applications. From audio processing to telecommunications, this product delivers exceptional quality and reliability that customers can trust. With integrated cache and low power mode, this DSP provides efficient processing capabilities while minimizing energy consumption. Experience the seamless operation and superior functionality of the TMS320C6713BZDP300, setting new standards in digital signal processing technology.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache helps in improving the speed and efficiency of processing data, making this product a good choice for applications requiring fast data retrieval and processing.

Maximum Supply Voltage: 1.47 V

With a relatively high maximum supply voltage, this DSP can handle higher power requirements without risking damage, making it suitable for applications that need a higher voltage supply.

RAM Words: 65536

A large RAM capacity allows for storing and processing a significant amount of data at once, making this product suitable for applications that require extensive data manipulation and storage.

Maximum Clock Frequency: 300 MHz

A high maximum clock frequency enables fast processing speeds, making this product ideal for applications requiring real-time signal processing or high-speed data calculations.

Technology: CMOS

Being based on CMOS technology, this DSP consumes less power and produces less heat, resulting in improved energy efficiency and reliability, making it a good choice for battery-powered devices or applications with strict power requirements.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6713BZDP300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6713BZDP300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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