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DSPIC33EV64GM102-I/MM

Microchip Technology

DSPIC33EV64GM102-I/MM by Microchip Technology

DSPIC33EV64GM102-I/MM by Microchip Technology is a 16-bit DSP with 40 MHz clock frequency, 11-Ch ADC, and 4 DMA channels. Ideal for industrial applications requiring high-speed processing, low power mode, and connectivity via CAN, I2C, SPI, UART interfaces.

Median Price

$4.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,263 parts In-Stock

1+ parts

$4.100

100+ parts

$3.400

1k+ parts

$3.130

10k+ parts

$2.970

1,263

$4.100

$3.400

$3.130

$2.970

DigiKey

USA . 401 parts In-Stock

1+ parts

$4.100

100+ parts

$3.400

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-

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-

401

$4.100

$3.400

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Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$4.100

100+ parts

$3.400

1k+ parts

$3.390

10k+ parts

-

246

$4.100

$3.400

$3.390

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,037 parts In-Stock

1+ parts

$4.280

100+ parts

$3.880

1k+ parts

$3.550

10k+ parts

-

1,037

$4.280

$3.880

$3.550

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Vyrian

USA . 7,511 parts In-Stock

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7,511

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 243 parts In-Stock

1+ parts

$3.480

100+ parts

-

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243

$3.480

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Corohmni

South Africa . 5,134 parts In-Stock

1+ parts

$22.950

100+ parts

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5,134

$22.950

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Aztec Data Supply Inc.

USA . 619 parts In-Stock

1+ parts

$43.780

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619

$43.780

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Lixinc

USA . 9,371 parts In-Stock

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9,371

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West Coast Incorporated

USA . 6,385 parts In-Stock

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6,385

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Continental Prestige Electronics

USA . 1,246 parts In-Stock

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Argo Parts USA

USA . 1,197 parts In-Stock

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1,197

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Perfect Parts

USA . 560 parts In-Stock

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560

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Overview

Elevate your projects with the cutting-edge DSPIC33EV64GM102-I/MM by Microchip Technology. As a leading manufacturer in the digital signal processors category, Microchip delivers top-notch quality and reliability. This versatile chip offers a wide range of applications with its advanced features, including multiple peripherals, low power mode, and high-speed operation up to 40 MHz. Experience seamless connectivity with CAN, I2C, SPI, UART, and more. Unlock the full potential of your designs with the DSPIC33EV64GM102-I/MM - delivering value, efficiency, and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective packaging material

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be encountered

No. of Timers: 7

Provides versatility in timing functions for various applications

Analog To Digital Convertors: 11-Ch 12-Bit

High precision conversion for accurate signal processing

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Offers versatile communication options for interfacing with other devices

Low Power Mode: YES

Allows for power-saving operation, ideal for battery-powered devices or energy-efficient applications

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV64GM102-I/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(4), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Trade Compliance

DSPIC33EV64GM102-I/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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