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DSPIC33FJ128GP706A-E/MR

Microchip Technology

DSPIC33FJ128GP706A-E/MR by Microchip Technology

DSPIC33FJ128GP706A-E/MR by Microchip is a 16-bit DSP with 3.3V supply, 40MHz clock frequency, and flash ROM. Ideal for automotive applications, it operates b/w -40 to 125 °C with a compact square package and quad terminals.

Median Price

$9.160

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 105 parts In-Stock

1+ parts

$9.160

100+ parts

$7.600

1k+ parts

$7.000

10k+ parts

$6.670

105

$9.160

$7.600

$7.000

$6.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 80 parts In-Stock

1+ parts

$9.500

100+ parts

$8.610

1k+ parts

$7.880

10k+ parts

-

80

$9.500

$8.610

$7.880

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Vyrian

USA . 5,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,761

-

-

-

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Nova Conductors

Japan . 83 parts In-Stock

1+ parts

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83

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 290 parts In-Stock

1+ parts

$7.790

100+ parts

$7.595

1k+ parts

$7.556

10k+ parts

-

290

$7.790

$7.595

$7.556

-

Ampacity Inc.

Singapore . 145 parts In-Stock

1+ parts

$7.790

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$7.790

-

-

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AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$10.494

100+ parts

-

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10k+ parts

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805

$10.494

-

-

-

Aztec Data Supply Inc.

USA . 154 parts In-Stock

1+ parts

$68.400

100+ parts

-

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154

$68.400

-

-

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Corohmni

South Africa . 300 parts In-Stock

1+ parts

$71.360

100+ parts

-

1k+ parts

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10k+ parts

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300

$71.360

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Lixinc

USA . 18,607 parts In-Stock

1+ parts

-

100+ parts

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18,607

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Argo Parts USA

USA . 3,730 parts In-Stock

1+ parts

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100+ parts

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3,730

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Continental Prestige Electronics

USA . 2,378 parts In-Stock

1+ parts

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2,378

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RGB Technical Solutions

Ukraine . 1,734 parts In-Stock

1+ parts

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1,734

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Discover the power and precision of the DSPIC33FJ128GP706A-E/MR by Microchip Technology. As a leader in digital signal processors, Microchip delivers unrivaled quality and reliability in every product. Whether you're designing automotive systems, controllers, or other applications, this DSP offers exceptional performance with a maximum clock frequency of 40 MHz and a flash ROM programmability. With a compact square package and a wide temperature range, this chip is the perfect solution for your next project. Unlock the potential of your designs with the DSPIC33FJ128GP706A-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 3.6 V

Operates efficiently within the specified voltage range ensuring stable performance.

Package Shape: SQUARE

Square package shape provides uniform distribution of components and ease of mounting.

Bit Size: 16

16-bit processing capability enables handling of complex digital signals with precision.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation of the DSP.

No. of Terminals: 64

Ample number of terminals allow for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in design and thermal management options.

Minimum Supply Voltage: 3 V

Ensures that the product can operate within a wide voltage range for compatibility with different systems.

Maximum Operating Temperature: 125 °C

Withstands high operating temperatures making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, ideal for various environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and placement on the PCB.

Maximum Seated Height: 1 mm

Low seated height saves space and enables compact designs.

Width: 9 mm

Narrow width facilitates compact PCB layouts and space-saving designs.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing of digital signals and data.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand reflow soldering process for up to 40 seconds ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for lead-free soldering process.

Length: 9 mm

Compact length contributes to overall space-efficient design.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature range ensures reliable performance in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality offers versatile signal processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation for efficient processing.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and provides reliable connections.

Maximum Supply Current: 90 mA

Low supply current consumption for efficient power management.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and space-saving designs.

Format: FIXED POINT

Fixed point format offers efficient processing of digital signals with limited precision requirements.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates robustness to moisture exposure during storage and handling.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128GP706A-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ128GP706A-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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