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DSPIC33EP256MU806T-I/MR

Microchip Technology

DSPIC33EP256MU806T-I/MR by Microchip Technology

DSPIC33EP256MU806T-I/MR by Microchip is a 16-bit DSP with 3.3V supply, 60MHz clock frequency, and 28672 RAM words. Ideal for industrial applications requiring high-speed processing, it features 9 timers, 15 DMA channels, and FLASH ROM programmability. With low power mode and boundary scan support, it offers efficient performance in compact form factor.

Median Price

$11.672

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$11.672

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100

$11.672

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Vyrian

USA . 8,740 parts In-Stock

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8,740

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Chip Stock

USA . 3,300 parts In-Stock

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3,300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 235 parts In-Stock

1+ parts

$6.820

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235

$6.820

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$7.025

100+ parts

$6.673

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$6.673

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300

$7.025

$6.673

$6.673

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AZTECH Wire

Italy . 816 parts In-Stock

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$10.365

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816

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Continental Prestige Electronics

USA . 5,050 parts In-Stock

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$11.672

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$11.439

5,050

$11.672

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$11.439

Netroflash

USA . 100 parts In-Stock

1+ parts

$11.672

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100

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Ampacity Inc.

Singapore . 436 parts In-Stock

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$26.000

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436

$26.000

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Semicontronic

India . 1,442 parts In-Stock

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$34.000

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$33.150

1k+ parts

$32.980

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1,442

$34.000

$33.150

$32.980

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Aztec Data Supply Inc.

USA . 4,961 parts In-Stock

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$53.631

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$53.631

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Lixinc

USA . 15,284 parts In-Stock

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LMD Electronica

Estonia . 7,821 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,455 parts In-Stock

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Montano Global Distributors

Canada . 1,262 parts In-Stock

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Argo Parts USA

USA . 1,124 parts In-Stock

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A-Z Elektronik GmbH

Germany . 600 parts In-Stock

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600

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NIA Electronics

USA . 599 parts In-Stock

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599

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Ledger Components

France . 599 parts In-Stock

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599

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Overview

Elevate your digital signal processing capabilities with the DSPIC33EP256MU806T-I/MR by Microchip Technology. As a leader in the industry, Microchip's expertise shines through in this high-quality DSP, offering unparalleled performance and reliability. Ideal for a wide range of applications in the digital signal processing category, this product provides exceptional value to customers by delivering advanced features, efficient power consumption, and seamless integration. Upgrade your projects with the innovative technology of Microchip's DSPIC33EP256MU806T-I/MR and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this DSP can handle a wide range of power input, providing flexibility in different applications.

Bit Size: 16

16-bit architecture allows for efficient processing of data and enhanced performance in signal processing tasks.

RAM Words: 28672

With a large RAM capacity of 28672 words, this DSP can store and process a significant amount of data, improving overall performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Being a digital signal processor and controller, this product can handle complex signal processing tasks as well as control functions, making it versatile for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and efficient operation, making this DSP a suitable choice for battery-operated devices or low-power applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU806T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256MU806T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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