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DSPIC33EP256MU806-E/PT

Microchip Technology

DSPIC33EP256MU806-E/PT by Microchip Technology

DSPIC33EP256MU806-E/PT by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It has 28672 RAM words and operates at a nominal voltage of 3.3V. This DSP is commonly used in automotive applications due to its temperature grade and low power mode capabilities.

Median Price

$10.016

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,035 parts In-Stock

1+ parts

$9.110

100+ parts

$7.570

1k+ parts

$6.460

10k+ parts

-

1,035

$9.110

$7.570

$6.460

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Arrow

USA . 154 parts In-Stock

1+ parts

$9.352

100+ parts

-

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-

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154

$9.352

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Element14

Singapore . 1,083 parts In-Stock

1+ parts

$10.016

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1,083

$10.016

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Microchip Technology

USA . 135,797 parts In-Stock

1+ parts

$10.280

100+ parts

$8.530

1k+ parts

$7.850

10k+ parts

$7.470

135,797

$10.280

$8.530

$7.850

$7.470

DigiKey

USA . 1,078 parts In-Stock

1+ parts

$10.280

100+ parts

$8.530

1k+ parts

-

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1,078

$10.280

$8.530

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Mouser Electronics

USA . 170 parts In-Stock

1+ parts

$10.280

100+ parts

$8.530

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-

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170

$10.280

$8.530

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Newark

USA . 629 parts In-Stock

1+ parts

$14.290

100+ parts

$11.860

1k+ parts

-

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629

$14.290

$11.860

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Master Electronics

USA . 303 parts In-Stock

1+ parts

-

100+ parts

$7.350

1k+ parts

$7.050

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303

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$7.350

$7.050

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Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$9.222

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300

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$9.222

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.637

100+ parts

-

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500

$9.637

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NAC Semi

USA . 109,600 parts In-Stock

1+ parts

$10.660

100+ parts

$9.670

1k+ parts

$8.840

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109,600

$10.660

$9.670

$8.840

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Chip Stock

USA . 11,060 parts In-Stock

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Vyrian

USA . 4,563 parts In-Stock

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4,563

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IBS Electronics

USA . 303 parts In-Stock

1+ parts

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$10.308

1k+ parts

$9.888

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303

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$10.308

$9.888

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,068 parts In-Stock

1+ parts

$7.220

100+ parts

$7.040

1k+ parts

$7.003

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-

5,068

$7.220

$7.040

$7.003

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Continental Prestige Electronics

USA . 1,152 parts In-Stock

1+ parts

$8.500

100+ parts

$7.060

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1,152

$8.500

$7.060

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$9.194

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289

$9.194

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$9.470

100+ parts

$8.996

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$8.996

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50

$9.470

$8.996

$8.996

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Ampacity Inc.

Singapore . 4,718 parts In-Stock

1+ parts

$15.730

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4,718

$15.730

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Aztec Data Supply Inc.

USA . 214 parts In-Stock

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$56.020

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214

$56.020

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Authorized Procurement Solutions

USA . 70,715 parts In-Stock

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70,715

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iodParts Technologies Inc.

India . 23,040 parts In-Stock

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Lixinc

USA . 17,859 parts In-Stock

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RGB Technical Solutions

Ukraine . 5,348 parts In-Stock

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Perfect Parts

USA . 2,150 parts In-Stock

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GreenTree Electronics

Israel . 1,920 parts In-Stock

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Argo Parts USA

USA . 1,778 parts In-Stock

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1,778

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$9.444

1k+ parts

$9.155

10k+ parts

$8.962

1,000

-

$9.444

$9.155

$8.962

Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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$0.121

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$0.121

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$0.121

150

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$0.121

$0.121

$0.121

Kepictronics

USA . 27 parts In-Stock

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27

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Overview

Experience unmatched performance and reliability with the DSPIC33EP256MU806-E/PT by Microchip Technology, a leading manufacturer in the field of digital signal processors (DSPs). This cutting-edge product offers a wide range of applications, making it perfect for various industries. With its advanced features and superior quality, this DSP provides exceptional value to customers. Benefit from its high-speed processing, low power consumption, and extensive memory capacity. Whether you're developing automotive systems or designing industrial automation solutions, the DSPIC33EP256MU806-E/PT is your ultimate choice for success. Trust Microchip Technology to deliver excellence, innovation, and unmatched customer satisfaction.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material ensures durability and protection for the DSP, making it a reliable choice.

Surface Mount:

YES. Surface mount technology allows for easy and efficient integration of the DSP into electronic devices, making it user-friendly.

Maximum Supply Voltage:

3.6 V. This high voltage tolerance enables the DSP to handle demanding power requirements, making it suitable for a wide range of applications.

On Chip Data RAM Width:

8. With an 8-bit data RAM width, the DSP can process and store large amounts of data efficiently, enhancing its performance capabilities.

Screening Level:

AEC-Q100; TS 16949. This compliance with automotive industry quality standards ensures the DSP's reliability and suitability for automotive applications.

Package Shape:

SQUARE. The square shape of the package allows for easy mounting and secure placement within electronic devices, ensuring stability.

Bit Size:

16. Having a 16-bit bit size enhances the DSP's processing speed and accuracy, making it capable of handling complex signal processing tasks effectively.

Power Supplies (V):

3.3. The 3.3V power supply enables compatibility with various electronic systems, making the DSP versatile and adaptable.

No. of Terminals:

64. With 64 terminals, the DSP can interface with multiple devices and components, expanding its connectivity capabilities.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH. This package style offers compactness, low profile, and high precision, making it suitable for space-constrained applications.

Minimum Supply Voltage:

3V. The ability to operate at low supply voltage ensures energy efficiency and compatibility with low-power systems, making the DSP power-efficient.

Maximum Operating Temperature:

125 °C. The high operating temperature range allows the DSP to perform in harsh environments, enhancing its versatility and reliability.

No. of External Interrupts:

5. With 5 external interrupts, the DSP can efficiently respond to and handle multiple events or signals simultaneously, increasing its responsiveness.

Minimum Operating Temperature:

40 °C. The low operating temperature range enables the DSP to function reliably in extreme cold conditions, making it suitable for various environments.

Terminal Finish:

MATTE TIN. The use of matte tin terminal finish provides corrosion resistance and ensures stable electrical connections, enhancing the DSP's durability.

Terminal Position:

QUAD. The quad terminal position allows for secure and stable solder connections, ensuring reliable performance in demanding applications.

Maximum Seated Height:

1.2 mm. With a low seated height, the DSP can be easily integrated into slim electronic devices, enabling compact design solutions.

RAM Words:

28672. The large RAM capacity of 28,672 words enables the DSP to efficiently process and store extensive data, enhancing its performance in data-intensive applications.

Width:

10 mm. The compact width of 10 mm makes the DSP suitable for applications requiring space-saving designs, ensuring versatility and easy integration.

Boundary Scan:

YES. The presence of boundary scan capability allows for efficient testing and debugging of the DSP, ensuring reliable and error-free operation.

Maximum Clock Frequency:

60 MHz. The high clock frequency capability enables fast and efficient signal processing, making the DSP ideal for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s):

40. This specification ensures that the DSP can withstand high-temperature soldering processes, ensuring reliable assembly and manufacturing.

Peak Reflow Temperature °C:

260. With a peak reflow temperature of 260°C, the DSP can withstand high-temperature soldering processes, guaranteeing secure electrical connections.

Internal Bus Architecture:

MULTIPLE. The multiple internal bus architecture enhances data transfer speed and efficiency within the DSP, maximizing its overall performance.

Length:

10 mm. The compact length of 10 mm allows for easy integration in small devices, offering design flexibility and space optimization.

Temperature Grade:

AUTOMOTIVE. With automotive temperature grade certification, the DSP can operate reliably in harsh temperature conditions, ensuring suitability for automotive applications.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, CONTROLLER. This specification indicates that the DSP can not only process digital signals but also control and manage peripheral devices, expanding its functionality.

No. of Timers:

11. With 11 timers, the DSP can accurately measure and control timing events, making it suitable for applications requiring precise timing control.

Technology:

CMOS. The use of CMOS technology ensures low power consumption, enabling the DSP to operate efficiently with reduced energy requirements.

Terminal Form:

GULL WING. The gull wing terminal form allows for secure solder connections, ensuring reliable performance even under high-stress conditions.

Maximum Supply Current:

95 mA. This high supply current capability ensures sufficient power delivery for demanding applications, enhancing the DSP's performance and versatility.

Nominal Supply Voltage:

3.3 V. The 3.3V nominal supply voltage makes the DSP compatible with various electronic systems, ensuring ease of integration and adaptability.

No. of DMA Channels:

15. With 15 DMA channels, the DSP can efficiently manage data transfers between peripheral devices and memory, improving overall system performance.

No. of Serial I/Os:

6. The presence of 6 serial I/Os enables versatile communication capabilities, allowing the DSP to interface with various external devices and systems.

ROM Programmability:

FLASH. The use of flash ROM allows for easy and flexible programming, enabling firmware updates and customization, making the DSP adaptable to different applications.

Terminal Pitch:

0.5 mm. With a small terminal pitch of 0.5 mm, the DSP can accommodate compact designs and densely packed electronic systems, ensuring space optimization.

Format:

FIXED POINT. The fixed-point format ensures efficient and precise numerical calculations, making the DSP suitable for applications requiring high accuracy.

Moisture Sensitivity Level (MSL):

3. The moisture sensitivity level rating of 3 ensures proper handling and storage requirements, ensuring the DSP's reliability and longevity.

Low Power Mode:

YES. The availability of a low power mode enables energy efficiency and power-saving capabilities, making the DSP suitable for battery-powered devices.

Barrel Shifter:

YES. The presence of a barrel shifter allows for efficient data manipulation and shifting operations, enhancing the DSP's processing capabilities.

On Chip Program ROM Width:

8. With an 8-bit program ROM width, the DSP can efficiently store and execute program instructions, ensuring smooth operation and high performance.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU806-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC33EP256MU806-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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