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TMS320F28235PTPQ

Texas Instruments

TMS320F28235PTPQ by Texas Instruments

TMS320F28235PTPQ by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 1.995V max supply voltage, and 176 terminals. Ideal for automotive applications, it features 8 external interrupts, 21 timers, and ADC channels for efficient signal processing in compact designs.

Median Price

$25.531

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 908 parts In-Stock

1+ parts

$25.531

100+ parts

$22.694

1k+ parts

$16.687

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908

$25.531

$22.694

$16.687

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Digiode

USA . 2,373 parts In-Stock

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$24.254

100+ parts

-

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2,373

$24.254

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$31.205

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10

$31.205

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Vyrian

USA . 7,398 parts In-Stock

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7,398

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AZTECH Wire

Italy . 374 parts In-Stock

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$5.237

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374

$5.237

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Corphita

USA . 4,852 parts In-Stock

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$22.978

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4,852

$22.978

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Bastille Electronics

Australia . 10 parts In-Stock

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$31.200

100+ parts

$29.640

1k+ parts

-

10k+ parts

$27.768

10

$31.200

$29.640

-

$27.768

Continental Prestige Electronics

USA . 2,023 parts In-Stock

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$31.205

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$30.581

2,023

$31.205

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$30.581

Corohmni

South Africa . 149 parts In-Stock

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$35.837

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149

$35.837

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Parana Technologies

USA . 2,304 parts In-Stock

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$42.142

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DigiPath Technology Company

USA . 2,079 parts In-Stock

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$46.404

100+ parts

$42.692

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2,079

$46.404

$42.692

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Ampacity Inc.

Singapore . 426 parts In-Stock

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$47.230

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426

$47.230

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ChromeModa Solutions

Germany . 2,822 parts In-Stock

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$47.351

100+ parts

$38.828

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2,822

$47.351

$38.828

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IDEA Electronic Components Group

UK . 1,434 parts In-Stock

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$47.351

100+ parts

$44.983

1k+ parts

$42.616

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1,434

$47.351

$44.983

$42.616

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Microchip USA

USA . 1,873 parts In-Stock

1+ parts

$68.510

100+ parts

$67.320

1k+ parts

$66.720

10k+ parts

$66.130

1,873

$68.510

$67.320

$66.720

$66.130

Kepictronics

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 704 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320F28235PTPQ by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers top-quality products that exceed industry standards. The TMS320F28235PTPQ offers unparalleled performance and versatility, making it the ideal choice for a wide range of applications. With its advanced features and reliable design, this DSP provides exceptional value and benefits to customers looking for a high-performance solution. Choose Texas Instruments for unmatched quality and innovation in digital signal processing technology.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in protecting the internal components of the DSP from damage.

Surface Mount YES

Surface mount capability allows for easy integration into circuit boards and reduces overall size of the product.

Maximum Supply Voltage 1.995 V

Allows for flexibility in power supply options while ensuring efficient performance.

On Chip Data RAM Width 16

Wide on-chip data RAM width enables faster data processing and storage capabilities.

Address Bus Width 20

A wider address bus allows for efficient communication between memory and processor, enhancing overall speed and performance.

Screening Level AEC-Q100

AEC-Q100 screening level ensures the product meets automotive industry standards for quality and reliability.

Package Shape SQUARE

Square package shape provides easy mounting options and efficient use of space on circuit boards.

Bit Size 32

A 32-bit architecture allows for high precision processing and efficient handling of complex data.

Power Supplies (V) 1.9,3.3

Multiple power supply options allow for compatibility with various systems and environments.

No. of Terminals 176

A higher number of terminals provide more connectivity options and versatility in integration with other components.

Package Style (Meter) FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Multiple package styles offer flexibility in design and mounting options for different applications.

Minimum Supply Voltage 1.805 V

Low minimum supply voltage ensures efficient power consumption and extends the product's operating life.

Maximum Operating Temperature 125 °C

High maximum operating temperature range ensures reliability in extreme conditions and industrial environments.

CPU Family C28X

Belonging to the C28X CPU family signifies high-performance computing capabilities and compatibility with a range of applications.

No. of External Interrupts 8

Multiple external interrupt channels allow for efficient handling of real-time events and improved responsiveness.

Minimum Operating Temperature -40 °C

Low minimum operating temperature ensures reliable performance even in cold environments or outdoor settings.

Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances connectivity, conductivity, and longevity of the product.

ADC Channels YES

Built-in ADC channels allow for analog signal processing and conversion, making the DSP ideal for a wide range of applications.

Terminal Position QUAD

Quad terminal position provides stable mounting and robust connection points for reliable performance.

Maximum Seated Height 1.6 mm

Low maximum seated height facilitates easy integration into compact devices, saving space and enabling sleek designs.

RAM Words 17408

High RAM word count enables efficient data storage and processing capabilities, crucial for handling complex algorithms and programs.

Width 24 mm

Compact width dimension allows for versatile placement and mounting options in various electronic systems and devices.

Boundary Scan YES

Boundary scan feature aids in testing and debugging, ensuring seamless integration and reliable performance in end products.

External Data Bus Width 32

Wide external data bus accommodates larger data transfers and enhances overall processing speed and efficiency.

Maximum Clock Frequency 150 MHz

High maximum clock frequency allows for rapid data processing and efficient execution of tasks, suitable for demanding applications.

Peak Reflow Temperature °C 260

High peak reflow temperature ensures robust soldering and reliable connections during assembly processes.

Internal Bus Architecture MULTIPLE

Multiple internal bus architecture offers enhanced performance, data throughput, and flexibility for diverse computing requirements.

Length 24 mm

Compact length dimension facilitates space-saving designs and allows for versatile integration into various electronic devices.

Temperature Grade AUTOMOTIVE

Automotive temperature grade signifies resilience to harsh operating conditions, making the DSP suitable for automotive applications.

Peripheral IC Type DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type enables the DSP to handle a wide range of functions and interfaces, enhancing its utility in different applications.

No. of Timers 21

A high number of timers allow for precise scheduling, event handling, and time-sensitive operations, enhancing overall system functionality.

RAM Bytes 69632

Large RAM capacity in bytes enables efficient data storage, retrieval, and manipulation for handling complex algorithms and applications.

Technology CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the DSP suitable for battery-powered devices and energy-efficient applications.

Terminal Form GULL WING

Gull wing terminal form provides secure mounting and reliable connections, ideal for applications requiring robust mechanical support and stability.

Maximum Supply Current 315 mA

Moderate maximum supply current ensures efficient power consumption and thermal management for reliable long-term operation.

Nominal Supply Voltage 1.9 V

Stable nominal supply voltage ensures consistent performance and reliable operation under varying load conditions.

No. of DMA Channels 6

Multiple DMA channels enable efficient data transfer and processing, reducing CPU workload and enhancing overall system performance.

PWM Channels YES

Built-in PWM channels allow for precise control of analog signals, making the DSP suitable for applications requiring accurate modulation and control.

ROM Programmability FLASH

Flash ROM programmability allows for flexible firmware updates, program storage, and customization, enhancing the versatility and adaptability of the DSP.

Terminal Pitch 0.5 mm

Fine terminal pitch enables high-density mounting and compact designs, making the DSP suitable for space-constrained applications.

Format FIXED POINT

Fixed-point format ensures efficient numerical processing and computational accuracy, suitable for a wide range of signal processing applications.

Moisture Sensitivity Level (MSL) 4

Moisture sensitivity level 4 indicates robust moisture resistance, making the DSP suitable for use in humid or damp environments.

Low Power Mode YES

Low power mode feature enables energy-efficient operation, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width 16

Wide on-chip program ROM width allows for efficient storage and execution of program instructions, enhancing overall processing speed and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28235PTPQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

176

No. of Timers:

21

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

RAM Words:

17408

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320F28235PTPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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