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TMS320VC33PGE120G4

Texas Instruments

TMS320VC33PGE120G4 by Texas Instruments

TMS320VC33PGE120G4 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 100 MHz. Ideal for digital signal processing applications requiring low power mode and barrel shifter functionality.

Median Price

$27.972

Lifecycle Status

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6

In-Stock Inventory

1k+

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Texas Instruments

USA . 100 parts In-Stock

1+ parts

$21.583

100+ parts

$18.853

1k+ parts

$13.002

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-

100

$21.583

$18.853

$13.002

-

Mouser Electronics

USA . 51 parts In-Stock

1+ parts

$34.360

100+ parts

$19.470

1k+ parts

$17.950

10k+ parts

-

51

$34.360

$19.470

$17.950

-

Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$15.697

100+ parts

-

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550

$15.697

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Digiode

USA . 1,288 parts In-Stock

1+ parts

$20.504

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1,288

$20.504

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Vyrian

USA . 4,415 parts In-Stock

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4,415

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Chip Stock

USA . 948 parts In-Stock

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948

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AZTECH Wire

Italy . 446 parts In-Stock

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$14.147

100+ parts

-

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446

$14.147

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Parana Technologies

USA . 103 parts In-Stock

1+ parts

$15.219

100+ parts

$1,413.315

1k+ parts

$13.697

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103

$15.219

$1,413.315

$13.697

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Continental Prestige Electronics

USA . 4,947 parts In-Stock

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$15.697

100+ parts

-

1k+ parts

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10k+ parts

$15.383

4,947

$15.697

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-

$15.383

DigiPath Technology Company

USA . 1,181 parts In-Stock

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$16.758

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1,181

$16.758

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ChromeModa Solutions

Germany . 3,835 parts In-Stock

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$17.100

100+ parts

$14.022

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3,835

$17.100

$14.022

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IDEA Electronic Components Group

UK . 898 parts In-Stock

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$17.100

100+ parts

$16.245

1k+ parts

$15.390

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898

$17.100

$16.245

$15.390

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Ampacity Inc.

Singapore . 80 parts In-Stock

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$18.350

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80

$18.350

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Semicontronic

India . 60 parts In-Stock

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$18.350

100+ parts

$17.891

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$17.800

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60

$18.350

$17.891

$17.800

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Corphita

USA . 296 parts In-Stock

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$19.425

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296

$19.425

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Corohmni

South Africa . 1,957 parts In-Stock

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$32.811

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1,957

$32.811

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Microchip USA

USA . 1,719 parts In-Stock

1+ parts

$55.090

100+ parts

$54.130

1k+ parts

$53.650

10k+ parts

$53.170

1,719

$55.090

$54.130

$53.650

$53.170

QUARKTWIN TECHNOLOGY LTD

USA . 9,656 parts In-Stock

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9,656

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Argo Parts USA

USA . 3,910 parts In-Stock

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3,910

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

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$15.383

1k+ parts

$14.912

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$14.598

500

-

$15.383

$14.912

$14.598

Authorized Procurement Solutions

USA . 35 parts In-Stock

1+ parts

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35

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Overview

Experience unparalleled performance and efficiency with the TMS320VC33PGE120G4 from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This Digital Signal Processor is ideal for a wide range of applications, offering seamless integration and exceptional processing power. Unlock new possibilities with this cutting-edge technology that provides unmatched value and benefits to our customers. Elevate your projects with the TMS320VC33PGE120G4 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

Having an integrated cache improves the speed and efficiency of the DSP by allowing it to store frequently accessed data for quick access.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89V ensures stable power delivery to the DSP, preventing damage from overvoltage.

On Chip Data RAM Width: 32

A wide on-chip data RAM width of 32 bits allows for efficient data processing and storage within the DSP.

Address Bus Width: 24

A large address bus width of 24 bits enables the DSP to access a wide range of memory locations, enhancing its versatility and performance.

Package Shape: SQUARE

The square package shape makes the DSP easy to handle and install, fitting well into standard electronic devices.

Bit Size: 32

With a 32-bit architecture, the DSP can handle complex calculations and data processing tasks with high precision and efficiency.

Power Supplies (V): 1.8, 3.3

Having multiple power supply options of 1.8V and 3.3V allows for compatibility with different power sources and flexibility in various applications.

No. of Terminals: 144

The 144 terminals provide ample connectivity options for interfacing with external devices and peripherals, enhancing the DSP's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers a compact and space-saving design for the DSP, making it suitable for small form factor applications.

Minimum Supply Voltage: 1.71 V

Having a minimum supply voltage of 1.71V ensures reliable operation of the DSP even under low power conditions, enhancing its performance and stability.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the DSP can withstand elevated temperatures without compromising its functionality, making it suitable for industrial and automotive applications.

No. of External Interrupts: 4

Having 4 external interrupts allows the DSP to react to external events and signals, enabling real-time processing and response in time-sensitive applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the DSP can operate in a wide range of temperature conditions, from cold environments to room temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers corrosion resistance and high conductivity for reliable connections, ensuring long-term performance and durability of the DSP.

Terminal Position: QUAD

The quad terminal position layout allows for easy and secure mounting of the DSP on the circuit board, ensuring proper alignment and connectivity for efficient operation.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6mm, the DSP can be installed in slim and compact spaces without compromising on its performance or functionality.

RAM Words: 34816

Having a large number of RAM words (34816) allows the DSP to store and process a significant amount of data simultaneously, enabling efficient multitasking and data-intensive applications.

Width: 20 mm

The 20mm width of the DSP makes it suitable for various electronic devices and PCB designs, offering compatibility and versatility in different applications.

Boundary Scan: YES

The boundary scan feature allows for comprehensive testing and debugging of the DSP during manufacturing and maintenance, ensuring high-quality and reliable performance.

External Data Bus Width: 32

With a wide external data bus width of 32 bits, the DSP can efficiently transfer data between external devices and memory locations, enhancing its data processing capabilities.

Maximum Clock Frequency: 100 MHz

The maximum clock frequency of 100 MHz allows the DSP to perform high-speed calculations and data processing tasks, delivering quick and efficient results in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30 seconds maximum time at peak reflow temperature of 260°C ensures proper soldering and connection of the DSP during manufacturing, enhancing its reliability and performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for proper soldering and mounting of the DSP onto the circuit board, ensuring secure connections and reliable operation.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architecture allows for efficient data transfer and processing within the DSP, enhancing its overall performance and responsiveness.

Length: 20 mm

The 20mm length of the DSP provides a compact and space-saving design, making it suitable for small form factor applications and devices where space is limited.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP serves as a digital signal processor, as well as other peripheral IC functionalities, offering versatility and flexibility in various applications and electronic devices.

No. of Timers: 2

Having 2 timers allows the DSP to manage time-sensitive tasks and events, enabling efficient scheduling and control in time-critical applications.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high-speed performance, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections for the DSP, ensuring proper alignment and contact with the circuit board for smooth operation.

Maximum Supply Current: 80 mA

With a maximum supply current of 80mA, the DSP operates efficiently and reliably under varying load conditions, ensuring stable power delivery and performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures consistent and stable power delivery to the DSP, allowing it to operate optimally and reliably in various applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides adequate spacing for easy installation and connection of the DSP to the circuit board, ensuring proper alignment and secure connectivity.

Format: FLOATING POINT

The floating-point format used in the DSP allows for high-precision calculations and data processing tasks, enabling accurate and efficient performance in complex mathematical operations.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state, conserving energy and extending battery life in portable and battery-powered devices.

Barrel Shifter: YES

The barrel shifter feature in the DSP enables efficient shifting and manipulation of data, improving the speed and performance of data processing tasks in arithmetic and logical operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC33PGE120G4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

34816

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC33PGE120G4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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