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DSPIC33EV256GM104T-I/ML

Microchip Technology

DSPIC33EV256GM104T-I/ML by Microchip Technology

DSPIC33EV256GM104T-I/ML by Microchip Technology is a 16-bit DSP with 262144 ROM words and 16384 RAM words. It operates at a max clock frequency of 40 MHz, suitable for industrial applications requiring high-speed processing. With features like 24-Ch 12-Bit ADCs, CAN, I2C, SPI connectivity, and low power mode, it's ideal for embedded control systems.

Median Price

$6.255

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$6.255

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$6.255

-

-

-

Vyrian

USA . 4,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,463

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,528 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,528

$2.000

-

-

-

Continental Prestige Electronics

USA . 767 parts In-Stock

1+ parts

$6.255

100+ parts

-

1k+ parts

-

10k+ parts

$6.130

767

$6.255

-

-

$6.130

Netroflash

USA . 500 parts In-Stock

1+ parts

$6.255

100+ parts

-

1k+ parts

$5.942

10k+ parts

$5.817

500

$6.255

-

$5.942

$5.817

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$17.144

100+ parts

-

1k+ parts

-

10k+ parts

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754

$17.144

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-

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Corohmni

South Africa . 2,220 parts In-Stock

1+ parts

$31.082

100+ parts

-

1k+ parts

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10k+ parts

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2,220

$31.082

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RGB Technical Solutions

Ukraine . 7,590 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,590

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Argo Parts USA

USA . 3,512 parts In-Stock

1+ parts

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100+ parts

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3,512

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Overview

Experience the next level of performance with the Microchip Technology DSPIC33EV256GM104T-I/ML Digital Signal Processor. Designed with cutting-edge technology and superior quality, this device offers unparalleled value for a wide range of applications. From industrial automation to automotive systems, this DSP provides advanced features like low power mode, multiple peripherals, and high-speed connectivity options. Trust in Microchip Technology's reputation for excellence and elevate your projects with the DSPIC33EV256GM104T-I/ML.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this DSP lightweight and cost-effective.

Surface Mount: YES

With surface mount capability, this DSP can be easily mounted on circuit boards, saving assembly time and cost.

Maximum Supply Voltage: 5.5 V

Operating at a maximum supply voltage of 5.5 V provides flexibility in power supply options for various applications.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 allows for efficient data processing and storage within the DSP.

Screening Level: TS 16949

The TS 16949 screening level ensures high-quality and reliability in performance, making this DSP a dependable choice.

Package Shape: SQUARE

The square package shape offers easy integration into electronic designs and efficient use of PCB space.

Bit Size: 16

The 16-bit size allows for high precision in calculations and processing, making this DSP ideal for complex tasks.

Power Supplies (V): 5

Operating at a nominal power supply voltage of 5 V ensures compatibility with standard power sources.

No. of Terminals: 44

The 44 terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The versatile package style options allow for customization and optimization based on specific design requirements.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM104T-I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

35

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.32SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

DSPIC33EV256GM104T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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