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DSPIC33EP128GS804T-I/ML

Microchip Technology

DSPIC33EP128GS804T-I/ML by Microchip Technology

DSPIC33EP128GS804T-I/ML by Microchip Technology is a 16-bit DSP with 131072 ROM words, 8192 RAM words, and a max clock frequency of 60 MHz. It features 17-Ch 12-Bit ADCs and peripherals like PWM(16) suitable for industrial applications requiring high-speed signal processing and precise analog-to-digital conversion. With low power mode and multiple connectivity options (CAN, I2C, SPI, UART), it offers versatile solutions in compact form factor for various digital signal processing needs.

Median Price

$8.130

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$8.130

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1,000

$8.130

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Vyrian

USA . 4,821 parts In-Stock

1+ parts

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4,821

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 472 parts In-Stock

1+ parts

$6.300

100+ parts

-

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472

$6.300

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Ampacity Inc.

Singapore . 205 parts In-Stock

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$8.000

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205

$8.000

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Continental Prestige Electronics

USA . 1,389 parts In-Stock

1+ parts

$8.130

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$7.967

1,389

$8.130

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$7.967

AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$14.274

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583

$14.274

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Semicontronic

India . 899 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

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899

$19.000

$18.525

$18.430

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Aztec Data Supply Inc.

USA . 19,140 parts In-Stock

1+ parts

$65.120

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19,140

$65.120

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RGB Technical Solutions

Ukraine . 5,925 parts In-Stock

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5,925

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Argo Parts USA

USA . 4,454 parts In-Stock

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4,454

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$7.967

1k+ parts

$7.724

10k+ parts

$7.561

100

-

$7.967

$7.724

$7.561

Overview

Unleash the power of cutting-edge technology with the DSPIC33EP128GS804T-I/ML by industry leader Microchip Technology. Designed for Digital Signal Processing applications, this high-quality DSP boasts unmatched performance and reliability. With features like multiple peripherals, flash ROM programmability, and low power mode, this chip offers unparalleled value to customers in industries ranging from automotive to industrial automation. Elevate your projects to new heights with the DSPIC33EP128GS804T-I/ML and experience the difference that superior technology can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this DSP lightweight and durable, suitable for portable devices.

Surface Mount: YES

With surface mount capability, this DSP can be easily integrated into circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it compatible with a wide range of systems.

On Chip Data RAM Width: 8

The wide on-chip data RAM width provides fast data processing speeds, enhancing the overall performance of the DSP.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability, making this DSP a dependable choice for critical applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS804T-I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

DSPIC33EP128GS804T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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