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TMS320C6657GZHA

Texas Instruments

TMS320C6657GZHA by Texas Instruments

TMS320C6657GZHA by Texas Instruments is a 32-bit DSP with integrated cache and 8-bit on-chip data RAM. It features a package style of grid array, fine pitch, and operates in industrial temperature grade. Ideal for digital signal processing applications requiring low power mode and floating-point format.

Median Price

$158.423

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 484 parts In-Stock

1+ parts

$117.736

100+ parts

$114.195

1k+ parts

$88.523

10k+ parts

-

484

$117.736

$114.195

$88.523

-

DigiKey

USA . 40 parts In-Stock

1+ parts

$199.110

100+ parts

$157.080

1k+ parts

-

10k+ parts

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40

$199.110

$157.080

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,138 parts In-Stock

1+ parts

$111.849

100+ parts

-

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1,138

$111.849

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$121.524

100+ parts

-

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700

$121.524

-

-

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Vyrian

USA . 8,542 parts In-Stock

1+ parts

-

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-

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8,542

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Chip Stock

USA . 554 parts In-Stock

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-

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554

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Distributors (Availability)

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AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$18.848

100+ parts

-

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-

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829

$18.848

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-

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Parana Technologies

USA . 1,853 parts In-Stock

1+ parts

$41.546

100+ parts

-

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1,853

$41.546

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DigiPath Technology Company

USA . 94 parts In-Stock

1+ parts

$45.747

100+ parts

-

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-

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94

$45.747

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ChromeModa Solutions

Germany . 3,052 parts In-Stock

1+ parts

$46.681

100+ parts

$38.278

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-

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3,052

$46.681

$38.278

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

1+ parts

$46.681

100+ parts

$44.347

1k+ parts

$42.013

10k+ parts

-

2,238

$46.681

$44.347

$42.013

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$49.605

100+ parts

$45.141

1k+ parts

$40.676

10k+ parts

-

5,000

$49.605

$45.141

$40.676

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Semicontronic

India . 23 parts In-Stock

1+ parts

$100.080

100+ parts

$97.578

1k+ parts

$97.078

10k+ parts

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23

$100.080

$97.578

$97.078

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Corphita

USA . 606 parts In-Stock

1+ parts

$105.962

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606

$105.962

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Corohmni

South Africa . 2,724 parts In-Stock

1+ parts

$113.309

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2,724

$113.309

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Bastille Electronics

Australia . 73 parts In-Stock

1+ parts

$121.500

100+ parts

$115.425

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-

10k+ parts

$108.135

73

$121.500

$115.425

-

$108.135

Continental Prestige Electronics

USA . 3,712 parts In-Stock

1+ parts

$121.524

100+ parts

-

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$119.093

3,712

$121.524

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-

$119.093

Ampacity Inc.

Singapore . 266 parts In-Stock

1+ parts

$217.810

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266

$217.810

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Lixinc

USA . 17,957 parts In-Stock

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17,957

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Argo Parts USA

USA . 3,996 parts In-Stock

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3,996

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Overview

Unleash the power of cutting-edge technology with the TMS320C6657GZHA by Texas Instruments. As a leader in digital signal processors, Texas Instruments ensures top-notch quality and reliability in every product. The TMS320C6657GZHA is a game-changer, offering integrated cache, multiple timers, and low power mode for optimal performance. Whether you're working on industrial automation, telecommunications, or audio processing applications, this DSP delivers unmatched value and efficiency. Elevate your projects with Texas Instruments' TMS320C6657GZHA and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic packaging for its durability and cost-effectiveness, making the product reliable and affordable.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency in handling data, making the product suitable for high-performance applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, making the product suitable for space-constrained applications.

Address Bus Width: 24

A wider address bus allows for accessing a larger memory space, enabling the product to handle complex algorithms and data processing tasks effectively.

Bit Size: 32

With a 32-bit architecture, the product can perform complex mathematical operations and data processing with higher precision and accuracy.

Power Supplies (V): 1, 1.5, 1.8

Support for multiple power supply voltages makes the product versatile and compatible with a wide range of power sources, ensuring reliable operation in different environments.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature makes the product suitable for industrial applications where extended periods of operation at elevated temperatures are required.

RAM Words: 8192

Having a large RAM capacity allows the product to store and process a significant amount of data quickly, making it ideal for real-time signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy electronic environments.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6657GZHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e0

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6657GZHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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