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TMS320F2808PZS

Texas Instruments

TMS320F2808PZS by Texas Instruments

TMS320F2808PZS by Texas Instruments is a 32-bit DSP with 100MHz clock frequency, 18432 RAM words, and flash ROM. Ideal for automotive applications due to AEC-Q100 screening level, it features 3 external interrupts, 10 timers, and PWM channels. With low power mode and boundary scan support, this DSP offers high performance in a compact package.

Median Price

$25.964

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Texas Instruments

USA . 450 parts In-Stock

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Farnell

UK . 835 parts In-Stock

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Newark

USA . 410 parts In-Stock

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$23.790

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DigiKey

USA . 458 parts In-Stock

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$31.350

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Element14

Singapore . 410 parts In-Stock

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RS (Exports)

UK . 86 parts In-Stock

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Greenchips

USA . 5 parts In-Stock

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$18.591

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$16.245

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$11.200

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$11.200

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$18.591

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$11.200

Digiode

USA . 1,376 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Chip Stock

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Vyrian

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Zilex Electronics Inc.

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Lantek

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North Shore Components

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Connector Distribution Corp

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Right Parts Inc.

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ComSIT Distribution GmbH

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SIE Connect GmbH - GreenChips

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Inventory MP

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Bristol Electronics

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Semicontronic

India . 864 parts In-Stock

1+ parts

$16.640

100+ parts

$16.224

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$16.141

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$16.640

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$16.141

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Ampacity Inc.

Singapore . 469 parts In-Stock

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$16.640

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$16.640

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Corphita

USA . 4,450 parts In-Stock

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$17.618

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Continental Prestige Electronics

USA . 950 parts In-Stock

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$24.020

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Parana Technologies

USA . 1,379 parts In-Stock

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$34.554

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DigiPath Technology Company

USA . 150 parts In-Stock

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ChromeModa Solutions

Germany . 2,211 parts In-Stock

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$38.825

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$31.836

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IDEA Electronic Components Group

UK . 902 parts In-Stock

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$36.884

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$34.942

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Modulus Dynamics

Lithuania . 4,632 parts In-Stock

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$39.423

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Corohmni

South Africa . 717 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$48.110

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Microchip USA

USA . 4,975 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Argo Parts USA

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Perfect Parts

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Netroflash

USA . 2,000 parts In-Stock

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$19.137

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$18.551

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Kepictronics

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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$0.345

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Futuretech Components

Singapore . 110 parts In-Stock

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Overview

Unlock the power of advanced signal processing with the TMS320F2808PZS by Texas Instruments. Designed with precision and reliability in mind, this digital signal processor offers unparalleled performance for a wide range of applications. From automotive to industrial automation, this versatile DSP delivers exceptional value and unbeatable benefits to customers seeking top-notch quality and cutting-edge technology. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.89 V

Provides a safe operating range for the device, protecting it from potential damage due to overvoltage.

On Chip Data RAM Width: 16

Enables efficient data processing and storage on the chip, enhancing the performance of the DSP.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, ensuring the product is suitable for automotive applications.

Bit Size: 32

Offers high computational power and precision, making it suitable for demanding signal processing tasks.

Power Supplies (V): 1.8,3.3

Provides flexibility in power options, allowing the product to be used in a variety of voltage environments.

No. of Terminals: 100

Offers ample connection points for interfacing with external devices, enhancing the versatility of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer flexibility in mounting options, making it easier to integrate the DSP into different systems.

Minimum Supply Voltage: 1.71 V

Ensures reliable operation at low voltages, allowing the product to function effectively in power-sensitive applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments without compromising performance.

CPU Family: C28X

Belongs to a proven CPU family known for its performance and reliability, ensuring high-quality signal processing capabilities.

No. of External Interrupts: 3

Allows for timely response to external events, enhancing the responsiveness of the product in real-time signal processing applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, making it suitable for use in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and improved conductivity, ensuring reliable connections for long-term performance.

ADC Channels: YES

Includes analog-to-digital conversion capability, allowing the product to interface with analog sensors and signals.

RAM Words: 18432

Offers a significant amount of memory for data storage and processing, enabling complex signal processing tasks.

Width: 14 mm

Compact size makes it suitable for space-constrained applications, enhancing the product's versatility.

Boundary Scan: YES

Facilitates testing and debugging of the product during manufacturing and maintenance, ensuring high quality and reliability.

Maximum Clock Frequency: 100 MHz

Provides fast processing speed for real-time signal processing applications, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, preventing damage to the product and ensuring long-term reliability.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, ensuring the product can be assembled using standard manufacturing processes.

Internal Bus Architecture: MULTIPLE

Enables efficient data transfer between different components within the DSP, optimizing performance and functionality.

Length: 14 mm

Compact size allows for easy integration into various systems, making it suitable for diverse applications.

Temperature Grade: AUTOMOTIVE

Certified for automotive use, ensuring reliability in challenging operating conditions typically found in vehicles.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral ICs optimize signal processing tasks, enhancing the product's performance and efficiency.

No. of Timers: 10

Enables precise timing control for different functions, enhancing the flexibility and functionality of the product.

RAM Bytes: 36864

High memory capacity allows for extensive data storage, enabling complex signal processing algorithms to be executed efficiently.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal design provides mechanical strength and easy soldering, ensuring reliable connections and durability.

Maximum Supply Current: 230 mA

Efficient power consumption ensures minimal power usage, making it suitable for battery-powered applications.

Nominal Supply Voltage: 1.8 V

Standard supply voltage for consistent performance and compatibility with various systems and components.

PWM Channels: YES

Includes pulse width modulation channels for precise control of output signals, enhancing the product's versatility.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updates and modifications to the firmware, improving flexibility and customization options.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact design and efficient use of board space, enabling smaller form factor designs.

Format: FIXED POINT

Fixed-point format ensures accurate and reliable numerical calculations, critical for signal processing tasks requiring precision.

Moisture Sensitivity Level (MSL): 2

MSL rating indicates the level of protection against moisture, making the product suitable for various environmental conditions.

Low Power Mode: YES

Includes low power mode for energy-efficient operation, extending battery life in portable applications and reducing overall power consumption.

On Chip Program ROM Width: 16

Optimized ROM width for efficient program storage and execution, improving overall performance and responsiveness of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808PZS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808PZS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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