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TMSDVC5410GGWR100

Texas Instruments

TMSDVC5410GGWR100 by Texas Instruments

TMSDVC5410GGWR100 by Texas Instruments is a 32-bit DSP with 32768 RAM words, operating at up to 50 MHz. Ideal for industrial applications, it features a 23-bit address bus width and low power mode for efficient processing in digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,574 parts In-Stock

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Vyrian

USA . 2,230 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 319 parts In-Stock

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$7.435

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One Stop Electronics

USA . 283 parts In-Stock

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$31.000

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Parana Technologies

USA . 1,395 parts In-Stock

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$69.432

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Corohmni

South Africa . 540 parts In-Stock

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$73.371

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DigiPath Technology Company

USA . 1,419 parts In-Stock

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$76.454

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ChromeModa Solutions

Germany . 5,474 parts In-Stock

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$78.014

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$63.971

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IDEA Electronic Components Group

UK . 1,044 parts In-Stock

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$78.014

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$74.113

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$70.213

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

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Overview

Unlock the power of cutting-edge technology with the TMSDVC5410GGWR100 by Texas Instruments, a leader in digital signal processors. Designed for high-performance applications, this DSP offers unparalleled precision and efficiency. With its advanced features and top-quality construction, this product delivers superior results, making it the ideal choice for industrial projects, telecommunications, and audio processing. Experience the value and benefits of Texas Instruments' expertise with the TMSDVC5410GGWR100 - your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy material makes the package lightweight and durable, making it suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation, making the product energy efficient.

Address Bus Width: 23

With a wide address bus width of 23, this DSP can handle large amounts of data and memory addressing efficiently.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easier integration into tight spaces within electronic devices.

Bit Size: 32

With a 32-bit architecture, this DSP can process data and perform calculations with higher precision and accuracy.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common power sources and makes integration easier.

No. of Terminals: 176

Having a high number of terminals allows for multiple connections and interfaces, making the DSP versatile and capable of handling diverse input/output needs.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates efficient thermal management and provides a compact form factor for space-constrained applications.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage requirement ensures reliable operation even under varying power conditions, enhancing the product's robustness.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the DSP to function effectively in extreme cold environments without compromising performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier soldering and assembly during manufacturing processes.

Maximum Seated Height: 1.4 mm

The low seated height is ideal for slim devices and ensures a compact overall design.

RAM Words: 32768

With a large RAM capacity of 32768 words, the DSP can store and access a significant amount of data, enabling efficient processing and storage.

Width: 15 mm

The compact width of 15mm allows for easy integration into various electronic devices without taking up too much space.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during production and maintenance, enhancing product reliability.

External Data Bus Width: 16

The 16-bit external data bus width enables efficient data transfer between the DSP and external components, improving overall system performance.

Maximum Clock Frequency: 50 MHz

Operating at a high clock frequency of 50MHz allows the DSP to perform fast calculations and data processing tasks, enhancing performance.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures improves data flow and communication within the DSP, enhancing overall efficiency and processing speed.

Length: 15 mm

The compact length of 15mm is suitable for space-constrained applications and enables the DSP to be integrated into smaller devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this DSP can operate reliably in harsh environments, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral capabilities enhances the versatility and functionality of the product for a broader range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection during soldering and ensures good electrical conductivity for optimal performance.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures stable and consistent performance under normal operating conditions, enhancing reliability.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8mm, the DSP allows for high-density mounting on circuit boards, maximizing space utilization.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and efficiency in data processing tasks, making the DSP suitable for real-time applications.

Low Power Mode: YES

The low power mode option allows for power-saving operation when full processing power is not required, extending battery life in portable devices.

Barrel Shifter: YES

The barrel shifter feature enhances the efficiency of shifting and rotating data within the DSP, improving overall processing speed and performance.

Technical Specifications

Digital Signal Processors (DSPs) TMSDVC5410GGWR100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B176

Length:

15 mm

Low Power Mode:

YES

No. of Terminals:

176

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA176,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMSDVC5410GGWR100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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