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TMSDC6727BGDHA250

Texas Instruments

TMSDC6727BGDHA250 by Texas Instruments

TMSDC6727BGDHA250 by Texas Instruments is a 32-bit DSP with integrated cache, 262144 RAM words, and 25 MHz clock frequency. Ideal for industrial applications requiring high-speed data processing and floating-point calculations in a compact square package.

Median Price

$35.144

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,170 parts In-Stock

1+ parts

$36.702

100+ parts

$32.624

1k+ parts

$23.988

10k+ parts

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21,170

$36.702

$32.624

$23.988

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Avnet

USA . 69 parts In-Stock

1+ parts

-

100+ parts

$33.587

1k+ parts

$30.143

10k+ parts

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69

-

$33.587

$30.143

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,396 parts In-Stock

1+ parts

$34.867

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3,396

$34.867

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Vyrian

USA . 3,312 parts In-Stock

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3,312

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Cyclops Electronics Ltd

UK . 14 parts In-Stock

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14

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Contempo Components LLC

USA . 12 parts In-Stock

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12

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Speed Components Ltd

Israel . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,054 parts In-Stock

1+ parts

$33.032

100+ parts

-

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4,054

$33.032

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-

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Parana Technologies

USA . 329 parts In-Stock

1+ parts

$35.022

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329

$35.022

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Corohmni

South Africa . 737 parts In-Stock

1+ parts

$37.942

100+ parts

-

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737

$37.942

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ChromeModa Solutions

Germany . 5,673 parts In-Stock

1+ parts

$39.350

100+ parts

$32.267

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5,673

$39.350

$32.267

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IDEA Electronic Components Group

UK . 762 parts In-Stock

1+ parts

$39.350

100+ parts

$37.382

1k+ parts

$35.415

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762

$39.350

$37.382

$35.415

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Lixinc

USA . 13,274 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,998 parts In-Stock

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Kepictronics

USA . 205 parts In-Stock

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DigiPath Technology Company

USA . 202 parts In-Stock

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$35.478

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202

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$35.478

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Speed Components Ltd (Excess)

Israel . 1 parts In-Stock

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1

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Overview

Experience unparalleled performance and reliability with the Texas Instruments TMSDC6727BGDHA250 Digital Signal Processor. Known for their superior quality and cutting-edge technology, Texas Instruments has crafted a product that exceeds industry standards. This DSP is ideal for a wide range of applications, offering customers unmatched value and benefits. From integrated cache to boundary scan capabilities, this product delivers on both functionality and efficiency. Trust in Texas Instruments to provide you with the tools you need to succeed in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

Having an integrated cache improves the efficiency and speed of data processing, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power management, ensuring stable operation under varying conditions.

Address Bus Width: 32

A wide address bus width enables efficient access to a large memory space, enhancing the capabilities of the DSP for handling complex algorithms.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast processing speeds, making the DSP suitable for real-time signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMSDC6727BGDHA250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Terminals:

256

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMSDC6727BGDHA250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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