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DSPIC33EP128GM306-E/MR

Microchip Technology

DSPIC33EP128GM306-E/MR by Microchip Technology

DSPIC33EP128GM306-E/MR by Microchip Technology is a 16-bit DSP with 3.3V supply, operating up to 60MHz. Ideal for automotive applications, it features 16384 RAM words, FLASH ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$5.479

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.479

100+ parts

-

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50

$5.479

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Vyrian

USA . 4,152 parts In-Stock

1+ parts

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4,152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,959 parts In-Stock

1+ parts

$5.479

100+ parts

-

1k+ parts

-

10k+ parts

$5.370

2,959

$5.479

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-

$5.370

AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$7.339

100+ parts

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423

$7.339

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Ampacity Inc.

Singapore . 1,149 parts In-Stock

1+ parts

$13.000

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1,149

$13.000

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RGB Technical Solutions

Ukraine . 5,071 parts In-Stock

1+ parts

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5,071

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Argo Parts USA

USA . 3,115 parts In-Stock

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3,115

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Microchip USA

USA . 2,833 parts In-Stock

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2,833

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Overview

Experience the power of cutting-edge technology with the DSPIC33EP128GM306-E/MR by Microchip Technology. Designed to meet the highest quality standards, this Digital Signal Processor offers unrivaled performance and reliability for a wide range of applications. From automotive to industrial use, this product provides value by delivering precision, efficiency, and versatility in a compact and easy-to-integrate package. Upgrade your projects with the DSPIC33EP128GM306-E/MR and unlock a world of possibilities in signal processing and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good protection for the DSP, making it durable and reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Having a maximum supply voltage of 3.6V allows for flexibility in power supply options while ensuring the safe operation of the DSP.

Bit Size: 16

With a 16-bit architecture, this DSP is capable of processing data with higher precision and accuracy, making it suitable for a wide range of signal processing applications.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means this DSP is designed to withstand the challenging temperature and environmental conditions of automotive applications, ensuring reliable performance in vehicle systems.

ROM Programmability: FLASH

The flash ROM allows for easy and efficient programming of the DSP, enabling quick updates and modifications to the firmware as needed.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM306-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP128GM306-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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