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DSPIC33EP128GM306T-I/MR

Microchip Technology

DSPIC33EP128GM306T-I/MR by Microchip Technology

DSPIC33EP128GM306T-I/MR by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It has 16384 RAM words and operates at an industrial temperature grade. This DSP is commonly used in applications requiring high-speed processing and control, such as motor control systems and audio processing devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,709 parts In-Stock

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7,709

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Nova Conductors

Japan . 74 parts In-Stock

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74

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Distributors (Availability)

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AZTECH Wire

Italy . 357 parts In-Stock

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$8.585

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357

$8.585

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Ampacity Inc.

Singapore . 749 parts In-Stock

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$28.000

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749

$28.000

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Continental Prestige Electronics

USA . 5,982 parts In-Stock

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Argo Parts USA

USA . 4,731 parts In-Stock

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Microchip USA

USA . 1,394 parts In-Stock

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Fulton Briggs Corp.

USA . 1,098 parts In-Stock

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1,098

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience the power and precision of the DSPIC33EP128GM306T-I/MR by Microchip Technology. As a leader in digital signal processors (DSPs), Microchip Technology sets the standard for quality and innovation. This versatile device opens up a world of possibilities across various applications. With its maximum clock frequency of 60 MHz and 16384 RAM words, it delivers fast and efficient performance. Whether you're working on industrial automation, motor control, or audio processing, this DSP will exceed your expectations. Trust Microchip Technology to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this DSP lightweight and durable, making it suitable for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power input, providing flexibility in various applications.

On Chip Data RAM Width: 8

The 8-bit wide on-chip data RAM provides efficient data storage and retrieval capabilities, enhancing the DSP's processing performance.

Screening Level: TS 16949

The TS 16949 screening level ensures that the DSP meets high-quality automotive industry standards, making it ideal for automotive applications.

Package Shape: SQUARE

The square package shape facilitates easy integration with other components on the PCB, maximizing space efficiency.

Bit Size: 16

With a 16-bit bit size, this DSP can handle complex digital signal processing tasks, delivering high-resolution and accurate results.

Power Supplies (V): 3.3

The 3.3V power supply voltage provides compatibility with common power sources, making integration and power management hassle-free.

No. of Terminals: 64

The 64 terminals offer sufficient connectivity options for interfacing with external components, enabling versatile circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with a heat sink/slug and a very thin profile ensures efficient heat dissipation and space-saving installation.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this DSP can operate even in low-power scenarios, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this DSP to perform reliably in harsh environments, increasing its suitability for industrial applications.

No. of External Interrupts: 5

Having 5 external interrupts allows the DSP to respond to real-time events swiftly and efficiently, making it appropriate for time-critical applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the DSP's functionality even in extremely cold environments, expanding its application range.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and long-lasting performance.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and assembly, enabling efficient and compact circuit designs.

Maximum Seated Height: 1 mm

With a low maximum seated height, this DSP can be easily incorporated into space-constrained electronic devices.

RAM Words: 16384

The 16384 RAM words offer sufficient memory capacity for storing and manipulating data, enabling complex signal processing algorithms.

Width: 9 mm

The 9mm width ensures that this DSP can fit into various form factors, providing design flexibility.

Boundary Scan: YES

The boundary scan feature enables efficient testing and diagnostics during manufacturing and maintenance, enhancing overall product reliability.

Maximum Clock Frequency: 60 MHz

With a high maximum clock frequency, this DSP can execute instructions rapidly, delivering real-time and high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds facilitates proper solder joint formation during manufacturing, ensuring reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and consistent soldering during the manufacturing process.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and communication within the DSP, improving overall processing efficiency.

Length: 9 mm

The 9mm length provides a compact footprint for this DSP, making it suitable for space-constrained electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures the DSP's reliability and performance even in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The peripheral IC type indicates that this DSP can handle both digital signal processing and control functions, offering versatility and convenience.

No. of Timers: 13

Having 13 timers allows precise timekeeping and event scheduling, making this DSP suitable for applications that require precise timing.

Technology: CMOS

The CMOS technology employed in this DSP ensures low power consumption, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: NO LEAD

The no-lead terminal form facilitates efficient soldering and provides better thermal performance, enhancing reliability and longevity.

Maximum Supply Current: 60 mA

With a low maximum supply current of 60 mA, this DSP minimizes power consumption and extends battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stability and compatibility with various electronic systems, making it a reliable choice.

No. of DMA Channels: 4

The 4 DMA channels enable efficient data transfer between different peripherals and memory, enhancing overall system performance.

No. of Serial I/Os: 4

Having 4 serial I/Os allows for easy interfacing with external devices, enabling seamless data exchange and versatility in connectivity options.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy firmware updates and reprogramming, ensuring flexibility and adaptability.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density PCB layouts, optimizing circuit board space and facilitating miniaturization.

Format: FIXED POINT

The fixed-point format supports efficient numerical computation with reduced complexity, enabling faster signal processing and accurate results.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this DSP can withstand moderate exposure to moisture during manufacturing and operation, ensuring long-term reliability.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state, conserving energy and prolonging battery life.

Barrel Shifter: YES

The barrel shifter functionality enhances arithmetic and logical operations, enabling efficient data manipulation and optimizing processing performance.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width facilitates efficient storage and retrieval of program instructions, enhancing overall execution speed.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM306T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP128GM306T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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