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DSPIC30F4013-20E/ML

Microchip Technology

DSPIC30F4013-20E/ML by Microchip Technology

DSPIC30F4013-20E/ML by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 125 °C. It's used in automotive applications as a digital signal processor and controller, featuring flash ROM programmability and CMOS technology for efficient processing.

Median Price

$11.176

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,080 parts In-Stock

1+ parts

$8.830

100+ parts

$7.280

1k+ parts

$6.680

10k+ parts

$6.390

1,080

$8.830

$7.280

$6.680

$6.390

Verical

USA . 51 parts In-Stock

1+ parts

-

100+ parts

$13.522

1k+ parts

-

10k+ parts

-

51

-

$13.522

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$7.900

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$7.900

-

-

-

NAC Semi

USA . 855 parts In-Stock

1+ parts

$9.100

100+ parts

$8.250

1k+ parts

$7.550

10k+ parts

-

855

$9.100

$8.250

$7.550

-

TME

Poland . 51 parts In-Stock

1+ parts

$10.400

100+ parts

$9.210

1k+ parts

-

10k+ parts

-

51

$10.400

$9.210

-

-

Vyrian

USA . 7,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,675

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 454 parts In-Stock

1+ parts

$7.510

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$7.510

-

-

-

Continental Prestige Electronics

USA . 6,074 parts In-Stock

1+ parts

$7.900

100+ parts

-

1k+ parts

-

10k+ parts

$7.742

6,074

$7.900

-

-

$7.742

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.900

100+ parts

$7.742

1k+ parts

-

10k+ parts

-

50

$7.900

$7.742

-

-

AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$13.150

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$13.150

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,884

-

-

-

-

QualityLine Systems

Poland . 7,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,352

-

-

-

-

XL Components Corporation

Australia . 4,583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,583

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,440

-

-

-

-

Argo Parts USA

USA . 3,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,355

-

-

-

-

Marpe Global Electronics

Taiwan . 1,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,126

-

-

-

-

Overview

Elevate your digital signal processing capabilities with the DSPIC30F4013-20E/ML from Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in all their products. The DSPIC30F4013-20E/ML falls into the category of Digital Signal Processors (DSPs) and is perfect for a wide range of applications. With a maximum clock frequency of 40 MHz and a flash ROM programmability, this product offers unmatched performance and flexibility. Experience the value and benefits of this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the DSP, suitable for various applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, reducing manufacturing time and costs.

Maximum Supply Voltage: 5.5 V

Allows for a higher voltage input, providing flexibility in power supply options.

Package Shape: SQUARE

Optimizes space utilization on the PCB and facilitates easy integration into electronic systems.

Bit Size: 16

Offers sufficient processing power for handling complex digital signal processing tasks efficiently.

Power Supplies (V): 3/5

Supports multiple power supply configurations, enhancing compatibility with various system designs.

No. of Terminals: 44

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal management, ensures efficient heat dissipation, and reduces the overall form factor of the DSP.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even under low voltage conditions, improving system robustness.

Maximum Operating Temperature: 125 °C

Ensures the DSP can perform reliably in high-temperature environments, ideal for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Allows the DSP to function in extreme cold environments, expanding its usability across various industries.

Terminal Finish: Matte Tin (Sn)

Provides a corrosion-resistant finish for enhanced durability and reliability.

Terminal Position: QUAD

Facilitates easier PCB layout and assembly, streamlining the manufacturing process.

Maximum Seated Height: 1 mm

Enables a compact and low-profile design, ideal for space-constrained applications.

Width: 8 mm

Compact width dimension allows for efficient placement on the PCB, optimizing board space.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast data processing, essential for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering during manufacturing, improving product reliability.

Peak Reflow Temperature °C: 260

Compatible with industry-standard reflow soldering processes, ensuring ease of manufacturing.

Length: 8 mm

Compact length dimension enables flexible placement within electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to meet the stringent temperature requirements of automotive applications, ensuring reliable performance in automotive systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combines DSP and controller functionalities, offering versatile processing capabilities for various system requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operations, enhancing energy efficiency and performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations, making the product eco-friendly.

Nominal Supply Voltage: 5 V

Optimal supply voltage for stable and efficient operation of the DSP, ensuring reliable performance.

ROM Programmability: FLASH

Offers flash programmability for easy firmware updates and customization, enhancing product flexibility.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density PCB layouts, maximizing functionality in limited space.

Format: FIXED POINT

Fixed-point format enhances computational efficiency for processing digital signals with reduced complexity.

On Chip Program ROM Width: 24

Provides ample storage capacity for program data, allowing for versatile application support and customization.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F4013-20E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 10 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC30F4013-20E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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