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DSPIC33EP128GM604-E/ML

Microchip Technology

DSPIC33EP128GM604-E/ML by Microchip Technology

DSPIC33EP128GM604-E/ML by Microchip Technology is a 16-bit DSP with 16384 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 3.3V supply voltage, -40 to 125 °C temperature range, and AEC-Q100 screening level.

Median Price

$11.808

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 780 parts In-Stock

1+ parts

$8.130

100+ parts

$6.750

1k+ parts

$6.210

10k+ parts

$5.920

780

$8.130

$6.750

$6.210

$5.920

Verical

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$15.485

1k+ parts

-

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35

-

$15.485

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$7.275

100+ parts

-

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-

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600

$7.275

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Vyrian

USA . 134 parts In-Stock

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134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 118 parts In-Stock

1+ parts

$6.910

100+ parts

-

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118

$6.910

-

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Semicontronic

India . 73 parts In-Stock

1+ parts

$6.910

100+ parts

$6.737

1k+ parts

$6.703

10k+ parts

-

73

$6.910

$6.737

$6.703

-

Continental Prestige Electronics

USA . 5,653 parts In-Stock

1+ parts

$7.275

100+ parts

-

1k+ parts

-

10k+ parts

$7.130

5,653

$7.275

-

-

$7.130

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.275

100+ parts

-

1k+ parts

$6.911

10k+ parts

$6.766

1,000

$7.275

-

$6.911

$6.766

Advanced Electronics

New Zealand . 85 parts In-Stock

1+ parts

$7.421

100+ parts

$7.421

1k+ parts

$7.421

10k+ parts

-

85

$7.421

$7.421

$7.421

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AZTECH Wire

Italy . 887 parts In-Stock

1+ parts

$9.647

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887

$9.647

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Aztec Data Supply Inc.

USA . 3,952 parts In-Stock

1+ parts

$22.750

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-

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3,952

$22.750

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Corohmni

South Africa . 331 parts In-Stock

1+ parts

$54.968

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331

$54.968

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Kepictronics

USA . 23,773 parts In-Stock

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23,773

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XL Components Corporation

Australia . 3,551 parts In-Stock

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3,551

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Lixinc

USA . 2,480 parts In-Stock

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2,480

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Argo Parts USA

USA . 1,586 parts In-Stock

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1,586

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QualityLine Systems

Poland . 699 parts In-Stock

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699

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Marpe Global Electronics

Taiwan . 521 parts In-Stock

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521

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Overview

Unleash the power of cutting-edge technology with the DSPIC33EP128GM604-E/ML by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality digital signal processors that cater to a wide range of applications. With its advanced features and reliable performance, this product offers unparalleled value and benefits to customers looking for precision and efficiency. Elevate your projects with the DSPIC33EP128GM604-E/ML and experience the difference that Microchip Technology brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product durable and lightweight.

Surface Mount: YES

This feature allows for easy and convenient mounting of the DSP.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs.

On Chip Data RAM Width: 8

The 8-bit width of the on-chip data RAM allows for efficient data processing.

Screening Level: AEC-Q100; TS 16949

This product meets high screening standards, ensuring reliability and quality.

Package Shape: SQUARE

The square package shape provides versatility in PCB layout and design.

Bit Size: 16

The 16-bit size of this DSP enables complex computations and high processing speeds.

Power Supplies (V): 3.3

The 3.3V power supply makes this DSP compatible with standard power sources.

No. of Terminals: 44

The 44 terminals offer ample connectivity options for peripherals and external devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This versatile package style allows for efficient heat dissipation and compact design.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this DSP can operate efficiently even with limited power.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance in various environments.

No. of External Interrupts: 5

The 5 external interrupts enhance the DSP's responsiveness to external events.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides corrosion resistance and conductivity.

Terminal Position: QUAD

The quad terminal position offers stability and ease of connection.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and space-saving PCB designs.

RAM Words: 16384

With 16384 RAM words, this DSP can handle large amounts of data efficiently.

Width: 8 mm

The 8mm width of the DSP makes it suitable for compact electronic devices.

Boundary Scan: YES

The boundary scan feature helps in debugging and testing the DSP during development.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency enables fast data processing and response times.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and processing efficiency.

Length: 8 mm

The 8mm length of the DSP adds to its compactness and suitability for small electronic devices.

Temperature Grade: AUTOMOTIVE

This product is designed to meet automotive-grade temperature requirements for robust performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

This DSP serves as both a digital signal processor and controller, offering versatility in applications.

No. of Timers: 15

The 15 timers provide versatility in scheduling and timing functions.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high speed operation.

Terminal Form: NO LEAD

The no lead terminal form enhances reliability and connectivity.

Maximum Supply Current: 60 mA

With a maximum supply current of 60mA, this DSP is energy efficient.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources.

No. of DMA Channels: 4

The 4 DMA channels enhance data transfer efficiency and processing speed.

No. of Serial I/Os: 6

The 6 serial I/Os provide flexibility in connecting to external devices and peripherals.

ROM Programmability: FLASH

The flash ROM programmability allows for easy updates and modifications to the DSP's firmware.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch offers space-saving advantages and ease of connection.

Format: FIXED POINT

The fixed-point format used in this DSP enables precise mathematical computations.

Low Power Mode: YES

The low power mode feature helps in conserving energy and prolonging battery life.

Barrel Shifter: YES

The barrel shifter feature enhances data processing efficiency and speed.

On Chip Program ROM Width: 24

The 24-bit width of the on-chip program ROM allows for storage of large programs and firmware.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM604-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

44

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

DSPIC33EP128GM604-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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