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DSPIC33FJ128MC804-E/ML

Microchip Technology

DSPIC33FJ128MC804-E/ML by Microchip Technology

DSPIC33FJ128MC804-E/ML by Microchip Technology is a 16-bit digital signal processor with 3.3V power supply, 44 terminals, and 8 DMA channels. It operates in automotive-grade temperatures (-40 to 125°C) and features flash ROM programmability for various applications requiring high-performance signal processing and control capabilities.

Median Price

$8.830

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,496 parts In-Stock

1+ parts

$8.830

100+ parts

$7.330

1k+ parts

-

10k+ parts

-

1,496

$8.830

$7.330

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Mouser Electronics

USA . 1,424 parts In-Stock

1+ parts

$8.830

100+ parts

$7.330

1k+ parts

$7.320

10k+ parts

-

1,424

$8.830

$7.330

$7.320

-

Microchip Technology

USA . 447 parts In-Stock

1+ parts

$8.830

100+ parts

$7.330

1k+ parts

$6.740

10k+ parts

$6.410

447

$8.830

$7.330

$6.740

$6.410

Verical

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$17.771

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28

-

$17.771

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$8.165

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1,000

$8.165

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NAC Semi

USA . 360 parts In-Stock

1+ parts

$9.150

100+ parts

$8.290

1k+ parts

$7.590

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360

$9.150

$8.290

$7.590

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Chip Stock

USA . 3,166 parts In-Stock

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3,166

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LIBRA Elektronik GmbH

Germany . 46 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 649 parts In-Stock

1+ parts

$7.280

100+ parts

$7.098

1k+ parts

$7.062

10k+ parts

-

649

$7.280

$7.098

$7.062

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$8.068

100+ parts

$8.068

1k+ parts

$8.068

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-

2,500

$8.068

$8.068

$8.068

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Continental Prestige Electronics

USA . 2,272 parts In-Stock

1+ parts

$8.165

100+ parts

-

1k+ parts

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10k+ parts

$8.002

2,272

$8.165

-

-

$8.002

Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

$8.165

100+ parts

$7.757

1k+ parts

-

10k+ parts

$7.267

900

$8.165

$7.757

-

$7.267

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$58.178

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254

$58.178

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Modulus Dynamics

Lithuania . 834 parts In-Stock

1+ parts

$60.205

100+ parts

$60.205

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$60.205

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834

$60.205

$60.205

$60.205

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Aztec Data Supply Inc.

USA . 241 parts In-Stock

1+ parts

$66.250

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241

$66.250

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QUARKTWIN TECHNOLOGY LTD

USA . 22,597 parts In-Stock

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Lixinc

USA . 10,202 parts In-Stock

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RC Electronics

USA . 9,297 parts In-Stock

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9,297

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Fulton Briggs Corp.

USA . 3,751 parts In-Stock

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3,751

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Perfect Parts

USA . 1,079 parts In-Stock

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1,079

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Argo Parts USA

USA . 268 parts In-Stock

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268

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Overview

Elevate your projects to new heights with the Microchip Technology DSPIC33FJ128MC804-E/ML digital signal processor. With a commitment to quality and innovation, Microchip Technology brings you a versatile solution for a wide range of applications in the digital signal processing category. Offering exceptional value, this product boasts high performance and reliability, making it the ideal choice for customers seeking cutting-edge technology. Transform your designs with the advantages and benefits that only the DSPIC33FJ128MC804-E/ML can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for the DSP, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration of the DSP into electronic circuits, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6V allows for versatility in powering the DSP and compatibility with a wide range of power sources.

On Chip Data RAM Width: 16

The 16-bit data RAM width enables the DSP to process and manipulate data efficiently, leading to faster and more accurate signal processing capabilities.

Package Shape: SQUARE

The square package shape provides a compact form factor for the DSP, making it easier to design and integrate into electronic systems with limited space.

Bit Size: 16

The 16-bit architecture of the DSP allows for handling of complex algorithms and signal processing tasks, delivering high performance and accuracy in calculations.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient power consumption and optimal performance of the DSP, making it energy-efficient and suitable for various applications.

No. of Terminals: 44

With 44 terminals, the DSP provides ample connectivity options for interfacing with external devices and peripherals, enhancing its versatility and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles including chip carrier, heat sink/slug, and very thin profile allows for flexibility in mounting and cooling options, optimizing the performance and reliability of the DSP.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures stable operation of the DSP under varying power conditions, enhancing reliability and performance in different environments.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the DSP can withstand high-temperature conditions, ensuring robust performance in demanding industrial and automotive applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128MC804-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33FJ128MC804-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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