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DSPIC33EV256GM104-E/ML

Microchip Technology

DSPIC33EV256GM104-E/ML by Microchip Technology

DSPIC33EV256GM104-E/ML by Microchip is a 16-bit DSP with 262144 ROM words, 16384 RAM words, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening, it offers CAN, I2C, SPI connectivity and operates at up to 40 MHz clock frequency.

Median Price

$5.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,325 parts In-Stock

1+ parts

$5.900

100+ parts

$4.900

1k+ parts

$4.520

10k+ parts

$4.280

1,325

$5.900

$4.900

$4.520

$4.280

Mouser Electronics

USA . 124 parts In-Stock

1+ parts

$5.900

100+ parts

$4.900

1k+ parts

-

10k+ parts

-

124

$5.900

$4.900

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.270

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$5.270

-

-

-

NAC Semi

USA . 1,035 parts In-Stock

1+ parts

$6.090

100+ parts

$5.520

1k+ parts

$5.050

10k+ parts

-

1,035

$6.090

$5.520

$5.050

-

Vyrian

USA . 8,799 parts In-Stock

1+ parts

-

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8,799

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-

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ComSIT Distribution GmbH

Germany . 467 parts In-Stock

1+ parts

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467

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 434 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$5.020

-

-

-

Continental Prestige Electronics

USA . 4,715 parts In-Stock

1+ parts

$5.270

100+ parts

-

1k+ parts

-

10k+ parts

$5.165

4,715

$5.270

-

-

$5.165

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$5.270

100+ parts

$5.006

1k+ parts

$4.756

10k+ parts

$4.690

450

$5.270

$5.006

$4.756

$4.690

Corohmni

South Africa . 28 parts In-Stock

1+ parts

$41.814

100+ parts

-

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28

$41.814

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RGB Technical Solutions

Ukraine . 6,567 parts In-Stock

1+ parts

-

100+ parts

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6,567

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Argo Parts USA

USA . 3,200 parts In-Stock

1+ parts

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100+ parts

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3,200

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EV256GM104-E/ML by industry leader Microchip Technology. This Digital Signal Processor offers unparalleled performance and versatility, making it ideal for a wide range of applications. With its advanced features and high-quality manufacturing, this product guarantees exceptional value and benefits for customers looking to stay ahead in the fast-paced world of electronics. Trust Microchip Technology for innovative solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for the product.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of supply voltage, making it versatile for different applications.

Bit Size: 16

With a 16-bit size, this product provides high processing power and accuracy.

Peripherals: BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Multiple peripherals offer added functionality and flexibility in controlling and interacting with external components.

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Wide range of connectivity options allows for seamless integration with other devices and systems.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM104-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

35

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.32SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

DSPIC33EV256GM104-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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