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DSPIC33FJ64GP306A-I/PT

Microchip Technology

DSPIC33FJ64GP306A-I/PT by Microchip Technology

DSPIC33FJ64GP306A-I/PT by Microchip is a 16-bit DSP with max clock freq of 40 MHz, operating temp range -40 to 85 °C. It's used in industrial applications as a digital signal processor and controller due to its flash ROM programmability and low supply current of 90 mA at 3.3 V.

Median Price

$6.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 104 parts In-Stock

1+ parts

$6.570

100+ parts

$5.450

1k+ parts

-

10k+ parts

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104

$6.570

$5.450

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$6.250

100+ parts

-

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67

$6.250

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NAC Semi

USA . 800 parts In-Stock

1+ parts

$6.820

100+ parts

$6.190

1k+ parts

$5.660

10k+ parts

-

800

$6.820

$6.190

$5.660

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Vyrian

USA . 1,952 parts In-Stock

1+ parts

-

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1,952

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IBS Electronics

USA . 640 parts In-Stock

1+ parts

-

100+ parts

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$8.120

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640

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-

$8.120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 253 parts In-Stock

1+ parts

$5.580

100+ parts

-

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253

$5.580

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$6.125

100+ parts

-

1k+ parts

$5.880

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500

$6.125

-

$5.880

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Continental Prestige Electronics

USA . 1,633 parts In-Stock

1+ parts

$6.250

100+ parts

-

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$6.125

1,633

$6.250

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-

$6.125

Semicontronic

India . 99 parts In-Stock

1+ parts

$12.150

100+ parts

$11.846

1k+ parts

$11.786

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-

99

$12.150

$11.846

$11.786

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AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$13.550

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632

$13.550

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$18.189

100+ parts

$17.279

1k+ parts

$17.279

10k+ parts

-

2,500

$18.189

$17.279

$17.279

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Aztec Data Supply Inc.

USA . 1,762 parts In-Stock

1+ parts

$51.990

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1,762

$51.990

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Corohmni

South Africa . 995 parts In-Stock

1+ parts

$78.240

100+ parts

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995

$78.240

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QUARKTWIN TECHNOLOGY LTD

USA . 15,229 parts In-Stock

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15,229

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Argo Parts USA

USA . 4,898 parts In-Stock

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4,898

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QualityLine Systems

Poland . 4,738 parts In-Stock

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4,738

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Marpe Global Electronics

Taiwan . 4,079 parts In-Stock

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4,079

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XL Components Corporation

Australia . 1,678 parts In-Stock

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1,678

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Lixinc

USA . 1,646 parts In-Stock

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1,646

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC33FJ64GP306A-I/PT. This cutting-edge product offers unparalleled performance and reliability, backed by Microchip's reputation for quality and innovation. Ideal for applications in a wide range of industries, this digital signal processor delivers high-speed operation and efficient processing capabilities. Experience the value and benefits of top-of-the-line technology with the DSPIC33FJ64GP306A-I/PT from Microchip Technology.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Lightweight material for easy handling and durability.

Surface Mount:

YES - Allows for easy installation and soldering onto circuit boards.

Maximum Supply Voltage:

3.6 V - Provides flexibility in power input requirements.

Package Shape:

SQUARE - Space-saving design for efficient use of PCB real estate.

Bit Size:

16 - Ideal for processing moderate to complex digital signals efficiently.

Power Supplies (V):

3.3 - Standard voltage supply for compatibility with many systems.

No. of Terminals:

64 - Sufficient connections for interfacing with other components.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - Streamlined package design for compact setups.

Minimum Supply Voltage:

3 V - Offers a wide operational voltage range for different applications.

Maximum Operating Temperature:

85 °C - Ensures performance under various environmental conditions.

Minimum Operating Temperature:

40 °C - Allows for operation in extreme cold conditions.

Terminal Finish:

MATTE TIN - Corrosion-resistant finish for long-lasting connections.

Terminal Position:

QUAD - Enables easy identification and organization of terminals.

Maximum Seated Height:

1.2 mm - Low-profile design for space-constrained applications.

Width:

10 mm - Compact width for efficient integration into circuit layouts.

Maximum Clock Frequency:

40 MHz - High clock speed for rapid signal processing.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C:

260 - Capable of withstanding high-temperature reflow soldering.

Length:

10 mm - Balanced length for a compact yet functional design.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with extended temperature ranges.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, CONTROLLER - Versatile functionality for signal processing and control tasks.

Technology:

CMOS - Efficient and reliable CMOS technology for low power consumption.

Terminal Form:

GULL WING - Secure terminal form for stable connections on PCBs.

Maximum Supply Current:

90 mA - Adequate current capacity for powering the DSP efficiently.

Nominal Supply Voltage:

3.3 V - Standard voltage level for consistent performance.

ROM Programmability:

FLASH - Convenient programmability for storing and executing code.

Terminal Pitch:

0.5 mm - Fine pitch spacing for compact layout and efficient routing.

Format:

FIXED POINT - Suitable for fixed-point arithmetic operations in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GP306A-I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC33FJ64GP306A-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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