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TMS320F2812ZHHS

Texas Instruments

TMS320F2812ZHHS by Texas Instruments

TMS320F2812ZHHS by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data RAM width. Ideal for automotive applications due to AEC-Q100 screening level, low power mode, and multiple internal bus architecture.

Median Price

$16.930

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

$16.930

100+ parts

$16.590

1k+ parts

$16.250

10k+ parts

-

4

$16.930

$16.590

$16.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,844 parts In-Stock

1+ parts

$16.084

100+ parts

-

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4,844

$16.084

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Vyrian

USA . 2,395 parts In-Stock

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2,395

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Nova Conductors

Japan . 92 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$5.744

100+ parts

-

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250

$5.744

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Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$14.390

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4

$14.390

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Semicontronic

India . 4 parts In-Stock

1+ parts

$14.390

100+ parts

$14.030

1k+ parts

$13.958

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4

$14.390

$14.030

$13.958

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Corphita

USA . 4,053 parts In-Stock

1+ parts

$15.237

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4,053

$15.237

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Corohmni

South Africa . 2,578 parts In-Stock

1+ parts

$21.161

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2,578

$21.161

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Parana Technologies

USA . 2,207 parts In-Stock

1+ parts

$42.466

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$42.466

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DigiPath Technology Company

USA . 984 parts In-Stock

1+ parts

$46.761

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984

$46.761

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ChromeModa Solutions

Germany . 2,780 parts In-Stock

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$47.715

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$39.126

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2,780

$47.715

$39.126

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IDEA Electronic Components Group

UK . 995 parts In-Stock

1+ parts

$47.715

100+ parts

$45.329

1k+ parts

$42.944

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995

$47.715

$45.329

$42.944

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$54.230

100+ parts

$51.518

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$51.518

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3,000

$54.230

$51.518

$51.518

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Lixinc

USA . 7,682 parts In-Stock

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7,682

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Continental Prestige Electronics

USA . 4,338 parts In-Stock

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4,338

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 3,791 parts In-Stock

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3,791

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Microchip USA

USA . 447 parts In-Stock

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447

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock the power of cutting-edge technology with the TMS320F2812ZHHS by Texas Instruments. Crafted with precision and expertise, this digital signal processor offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, this versatile DSP is designed to meet your unique needs with ease. Experience seamless operation and superior functionality, all while reaping the benefits of Texas Instruments' renowned quality and innovation. Elevate your projects to new heights with the TMS320F2812ZHHS - where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 2 V

Allows for efficient power usage and compatibility with various power sources.

Address Bus Width: 19

Enables the processor to access a large memory address space, improving overall performance.

Bit Size: 32

Offers high computational power and accuracy for processing digital signals.

No. of Terminals: 179

Provides ample connectivity options for interfacing with other components and systems.

Maximum Clock Frequency: 150 MHz

Allows for fast data processing and real-time signal analysis.

RAM Bytes: 36864

Offers a large amount of memory for storing and processing data efficiently.

Technology: CMOS

Uses CMOS technology for low power consumption and high-speed performance.

Maximum Supply Current: 230 mA

Efficient power usage ensures optimal performance and longevity of the product.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture levels, making it suitable for varied environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812ZHHS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812ZHHS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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