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DSPIC33EP256GP506-I/MR

Microchip Technology

DSPIC33EP256GP506-I/MR by Microchip Technology

DSPIC33EP256GP506-I/MR by Microchip Technology is a 16-bit DSP with 3.3V supply, 60MHz clock frequency, and 32768 RAM words. Ideal for industrial applications requiring digital signal processing, it features CMOS technology, FLASH ROM programmability, and low power mode for efficient operation.

Median Price

$5.410

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 535 parts In-Stock

1+ parts

$5.340

100+ parts

$4.550

1k+ parts

$4.540

10k+ parts

-

535

$5.340

$4.550

$4.540

-

Microchip Technology

USA . 1,600 parts In-Stock

1+ parts

$5.480

100+ parts

$4.550

1k+ parts

$4.170

10k+ parts

$3.980

1,600

$5.480

$4.550

$4.170

$3.980

DigiKey

USA . 90 parts In-Stock

1+ parts

$5.480

100+ parts

$4.550

1k+ parts

-

10k+ parts

-

90

$5.480

$4.550

-

-

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.468

10k+ parts

-

480

-

-

$4.468

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$4.910

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$4.910

-

-

-

NAC Semi

USA . 1,280 parts In-Stock

1+ parts

$5.690

100+ parts

$5.160

1k+ parts

$4.720

10k+ parts

-

1,280

$5.690

$5.160

$4.720

-

Vyrian

USA . 4,140 parts In-Stock

1+ parts

-

100+ parts

-

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4,140

-

-

-

-

Cyclops Electronics Ltd

UK . 200 parts In-Stock

1+ parts

-

100+ parts

-

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200

-

-

-

-

Elcom Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 694 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

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694

$3.800

-

-

-

Semicontronic

India . 603 parts In-Stock

1+ parts

$3.800

100+ parts

$3.705

1k+ parts

$3.686

10k+ parts

-

603

$3.800

$3.705

$3.686

-

Continental Prestige Electronics

USA . 789 parts In-Stock

1+ parts

$4.910

100+ parts

-

1k+ parts

-

10k+ parts

$4.812

789

$4.910

-

-

$4.812

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$5.008

100+ parts

$5.008

1k+ parts

$5.008

10k+ parts

-

270

$5.008

$5.008

$5.008

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Aztec Data Supply Inc.

USA . 167 parts In-Stock

1+ parts

$34.910

100+ parts

-

1k+ parts

-

10k+ parts

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167

$34.910

-

-

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Corohmni

South Africa . 42 parts In-Stock

1+ parts

$82.949

100+ parts

-

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42

$82.949

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-

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Lixinc

USA . 9,754 parts In-Stock

1+ parts

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9,754

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NIA Electronics

USA . 8,237 parts In-Stock

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8,237

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Ledger Components

France . 8,237 parts In-Stock

1+ parts

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8,237

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-

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LOOK Integrated Logistics

Peru . 6,062 parts In-Stock

1+ parts

-

100+ parts

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6,062

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-

-

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LMD Electronica

Estonia . 5,626 parts In-Stock

1+ parts

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5,626

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Montano Global Distributors

Canada . 5,366 parts In-Stock

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5,366

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Argo Parts USA

USA . 4,075 parts In-Stock

1+ parts

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4,075

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Glotronic Ltd.

UK . 384 parts In-Stock

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384

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.812

1k+ parts

$4.664

10k+ parts

$4.566

50

-

$4.812

$4.664

$4.566

Overview

Unlock the power of digital signal processing with the Microchip Technology DSPIC33EP256GP506-I/MR. Manufactured by a trusted industry leader, this high-quality DSP offers unparalleled performance and versatility in a wide range of applications. With its advanced features and reliable design, this product delivers exceptional value and benefits to customers looking for cutting-edge solutions in digital signal processing. Experience enhanced efficiency and innovation with the DSPIC33EP256GP506-I/MR from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this DSP can be easily integrated into compact electronic systems, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

A high maximum supply voltage allows for flexibility in power requirements, making this DSP suitable for a variety of applications.

On Chip Data RAM Width: 8

The wide data RAM width ensures efficient data processing, making this DSP a powerful choice for handling complex algorithms.

Screening Level: TS 16949

The TS 16949 screening level indicates high quality and reliability, making this DSP a dependable choice for critical systems.

Package Shape: SQUARE

The square package shape provides even heat dissipation, enhancing the DSP's performance and longevity.

Bit Size: 16

A 16-bit architecture allows for precise calculations and data manipulation, making this DSP a high-performance solution for demanding tasks.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common power sources, making this DSP easy to integrate into existing systems.

No. of Terminals: 64

With 64 terminals, this DSP offers ample connectivity options, enabling versatile interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles provides efficient heat dissipation and compact form factor, making this DSP suitable for space-constrained applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256GP506-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256GP506-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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