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DSPIC33CK32MC102T-E/M6

Microchip Technology

DSPIC33CK32MC102T-E/M6 by Microchip Technology

DSPIC33CK32MC102T-E/M6 by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 3.3V supply voltage, and AEC-Q100 screening for automotive applications. Featuring 8192 RAM words, FLASH ROM programmability, and low power mode, it's ideal for digital signal processing tasks in automotive electronics.

Median Price

$1.340

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.340

100+ parts

-

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300

$1.340

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Vyrian

USA . 1,320 parts In-Stock

1+ parts

-

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-

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1,320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,870 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

$1.313

3,870

$1.340

-

-

$1.313

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

$1.273

10k+ parts

$1.246

500

$1.340

-

$1.273

$1.246

Argo Parts USA

USA . 123 parts In-Stock

1+ parts

$1.340

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-

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123

$1.340

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Advanced Electronics

New Zealand . 17 parts In-Stock

1+ parts

$1.367

100+ parts

$1.367

1k+ parts

$1.367

10k+ parts

-

17

$1.367

$1.367

$1.367

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AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$6.412

100+ parts

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274

$6.412

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Ampacity Inc.

Singapore . 429 parts In-Stock

1+ parts

$21.000

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429

$21.000

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Semicontronic

India . 840 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

840

$34.000

$33.150

$32.980

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Aztec Data Supply Inc.

USA . 242 parts In-Stock

1+ parts

$62.930

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242

$62.930

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Corohmni

South Africa . 868 parts In-Stock

1+ parts

$82.599

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868

$82.599

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Marpe Global Electronics

Taiwan . 7,549 parts In-Stock

1+ parts

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7,549

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QualityLine Systems

Poland . 7,549 parts In-Stock

1+ parts

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7,549

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XL Components Corporation

Australia . 7,549 parts In-Stock

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7,549

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Overview

Revolutionize your digital signal processing with the DSPIC33CK32MC102T-E/M6 by Microchip Technology. Known for its high-quality manufacturing, this digital signal processor offers unmatched performance and reliability. Ideal for automotive applications, this product boasts a wide range of features including multiple internal bus architecture, flash ROM programmability, and low power mode to optimize efficiency. Experience the value and benefits of this cutting-edge technology and elevate your projects to new heights with the DSPIC33CK32MC102T-E/M6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments and applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and potential performance enhancements.

RAM Words: 8192

Having a large RAM capacity enables the DSP to handle complex processing tasks and store more data efficiently.

Maximum Clock Frequency: 64 MHz

A high clock frequency allows for faster processing speeds and improved performance in executing algorithms and calculations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK32MC102T-E/M6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Maximum Supply Current:

29.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CK32MC102T-E/M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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