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DSPIC33EP256MC202-E/MM

Microchip Technology

DSPIC33EP256MC202-E/MM by Microchip Technology

DSPIC33EP256MC202-E/MM by Microchip Technology is a 16-bit digital signal processor with 32768 RAM words and a max clock frequency of 60 MHz. Ideal for automotive applications, it features 3.3V nominal voltage, FLASH ROM programmability, and low power mode for efficient operation.

Median Price

$4.185

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$4.185

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100

$4.185

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Vyrian

USA . 4,765 parts In-Stock

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4,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,132 parts In-Stock

1+ parts

$4.185

100+ parts

-

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$4.101

6,132

$4.185

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$4.101

Argo Parts USA

USA . 1,352 parts In-Stock

1+ parts

$4.185

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1,352

$4.185

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Netroflash

USA . 500 parts In-Stock

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$4.185

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$4.101

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500

$4.185

$4.101

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Semicontronic

India . 159 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

159

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 270 parts In-Stock

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$16.542

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270

$16.542

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Ampacity Inc.

Singapore . 628 parts In-Stock

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$19.000

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628

$19.000

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Corohmni

South Africa . 257 parts In-Stock

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$56.439

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257

$56.439

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Aztec Data Supply Inc.

USA . 303 parts In-Stock

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$66.030

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303

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LOOK Integrated Logistics

Peru . 4,540 parts In-Stock

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LMD Electronica

Estonia . 3,969 parts In-Stock

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Montano Global Distributors

Canada . 2,251 parts In-Stock

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NIA Electronics

USA . 635 parts In-Stock

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635

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Ledger Components

France . 635 parts In-Stock

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635

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Microchip USA

USA . 277 parts In-Stock

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277

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EP256MC202-E/MM from Microchip Technology. Designed to deliver superior performance in digital signal processing applications, this product boasts top-notch quality and reliability. With a maximum operating temperature of 125°C and automotive-grade temperature grade, this digital signal processor is perfect for demanding environments. Experience seamless integration and efficient operation with its flash ROM programmability, low power mode, and versatile peripheral IC type. Enhance your projects with the value, benefits, and advantages that only the DSPIC33EP256MC202-E/MM can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving space and improving overall performance.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data processing and more efficient handling of large amounts of data.

Bit Size: 16

A 16-bit processor can handle more complex calculations and data manipulations compared to lower bit sizes, making it suitable for advanced signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and improved reliability, making the product energy-efficient and stable for long-term use.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC202-E/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33EP256MC202-E/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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