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DSPIC33EP256MU814T-I/PH

Microchip Technology

DSPIC33EP256MU814T-I/PH by Microchip Technology

DSPIC33EP256MU814T-I/PH by Microchip Technology is a 16-bit digital signal processor with 28672 RAM words, operating at a max frequency of 60 MHz. It features 9 timers, 15 DMA channels, and FLASH ROM programmability. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$10.300

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$10.300

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50

$10.300

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Vyrian

USA . 3,009 parts In-Stock

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3,009

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,471 parts In-Stock

1+ parts

$10.300

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$10.094

1,471

$10.300

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$10.094

AZTECH Wire

Italy . 727 parts In-Stock

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$17.086

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QUARKTWIN TECHNOLOGY LTD

USA . 27,348 parts In-Stock

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NIA Electronics

USA . 7,859 parts In-Stock

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7,859

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Ledger Components

France . 7,859 parts In-Stock

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7,859

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LMD Electronica

Estonia . 7,434 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,018 parts In-Stock

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Argo Parts USA

USA . 3,207 parts In-Stock

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Montano Global Distributors

Canada . 1,206 parts In-Stock

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Overview

Unleash the power of innovation with Microchip Technology's DSPIC33EP256MU814T-I/PH, a top-of-the-line Digital Signal Processor designed for cutting-edge applications. With a focus on quality and reliability, this product offers unparalleled performance and efficiency, making it the ideal choice for a wide range of projects in industries such as automotive, industrial control, and consumer electronics. Experience seamless operation and advanced capabilities with this state-of-the-art DSP, setting new standards for excellence in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input, accommodating a range of power sources.

Bit Size: 16

With a larger bit size, the product can handle more complex data processing tasks efficiently.

Width: 16 mm

Compact size allows for easy integration into various electronic systems.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast data processing and response times.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy efficient.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the device, providing flexibility for future updates and changes.

Low Power Mode: YES

Low power mode helps to conserve energy when the product is not in full use, increasing overall efficiency.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU814T-I/PH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.7SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

16 mm

Trade Compliance

DSPIC33EP256MU814T-I/PH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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